公开(公告)号：US20180132373A1

公开(公告)日：2018-05-10

申请号：US15803899

申请日：2017-11-06

Applicant: AMETEK, INC.

Inventor： Charles M. Italiano ,  Thomas A. Bobal ,  Maurice P.C. Mevissen

IPC: H05K5/06 ,  H05K5/03 ,  H05K5/04

CPC classification number: H05K5/069 ,  H01L21/4803 ,  H01L23/10 ,  H05K5/03 ,  H05K5/04

Abstract: Aspects of the invention relate to cover assemblies and methods for manufacturing such cover assemblies. According to one aspect of the invention, a cover assembly is provided for hermetically sealing electronic circuitry. The cover assembly includes a cover having a frame connection surface. The frame connection surface has a periphery section extending along an outer portion of the frame connection surface. The cover assembly also includes a frame having an annulus shape and a cover connection surface and a package connection surface spaced from the cover connection surface. Additionally, the cover assembly includes a laser weld that couples the cover connection surface of the frame to the frame connection surface of the cover in the periphery section to form the cover assembly. The package connection surface of the frame is exposed for attachment to the substrate after the cover assembly is formed.

公开(公告)号：US09238852B2

公开(公告)日：2016-01-19

申请号：US14026273

申请日：2013-09-13

Applicant: AMETEK, Inc.

Inventor： Muktesh Paliwal ,  Ryan A. Smith ,  Kerry B. Daley ,  Charles M. Italiano ,  Yakov Mindin

IPC: C22C1/04 ,  B22F1/00 ,  B22F3/02 ,  B22F3/10 ,  B22F3/24 ,  B22F5/00 ,  C22C27/04 ,  C22F1/18 ,  B22F3/18

CPC classification number: C22C1/045 ,  B22F1/0011 ,  B22F1/0059 ,  B22F1/0081 ,  B22F3/02 ,  B22F3/1017 ,  B22F3/16 ,  B22F3/18 ,  B22F3/24 ,  B22F5/006 ,  B22F2003/185 ,  B22F2003/248 ,  B22F2998/10 ,  B22F2999/00 ,  C22C27/04 ,  C22F1/18 ,  B22F2301/20 ,  B22F3/10 ,  B22F2201/01 ,  B22F2201/013 ,  B22F2201/10 ,  B22F2201/20 ,  B22F2304/10

Abstract: A method of making a molybdenum or molybdenum alloy metal strip is disclosed. The method includes roll compacting a molybdenum-based powder into a green strip. The method also includes sintering the green strip followed by a combination of warm rolling, annealing, and cold rolling steps to form the final metal strip which may be cut-to-length. The strip at the final thickness may also undergo an optional stress relief step.

Abstract translation: 公开了一种制造钼或钼合金金属带的方法。 该方法包括将钼基粉末辊压成绿色条带。 该方法还包括将生坯条烧结，然后进行温轧，退火和冷轧步骤的组合，以形成可切割长度的最终金属条。 最终厚度的条带也可以经受可选的应力消除步骤。

公开(公告)号：US20150078950A1

公开(公告)日：2015-03-19

申请号：US14026273

申请日：2013-09-13

Applicant: AMETEK, Inc.

Inventor： Muktesh Paliwal ,  Ryan A. Smith ,  Kerry B. Daley ,  Charles M. Italiano ,  Yakov Mindin

IPC: C22C1/04 ,  C22F1/18 ,  C22C27/04 ,  B22F3/02 ,  B22F3/10 ,  B22F3/24 ,  B22F5/00 ,  B22F1/00

CPC classification number: C22C1/045 ,  B22F1/0011 ,  B22F1/0059 ,  B22F1/0081 ,  B22F3/02 ,  B22F3/1017 ,  B22F3/16 ,  B22F3/18 ,  B22F3/24 ,  B22F5/006 ,  B22F2003/185 ,  B22F2003/248 ,  B22F2998/10 ,  B22F2999/00 ,  C22C27/04 ,  C22F1/18 ,  B22F2301/20 ,  B22F3/10 ,  B22F2201/01 ,  B22F2201/013 ,  B22F2201/10 ,  B22F2201/20 ,  B22F2304/10

Abstract: A method of making a molybdenum or molybdenum alloy metal strip is disclosed. The method includes roll compacting a molybdenum-based powder into a green strip. The method also includes sintering the green strip followed by a combination of warm rolling, annealing, and cold rolling steps to form the final metal strip which may be cut-to-length. The strip at the final thickness may also undergo an optional stress relief step.

Abstract translation: 公开了一种制造钼或钼合金金属带的方法。 该方法包括将钼基粉末辊压成绿色条带。 该方法还包括将生坯条烧结，然后进行温轧，退火和冷轧步骤的组合，以形成可切割长度的最终金属条。 最终厚度的条带也可以经受可选的应力消除步骤。