公开(公告)号：US20180132376A1

公开(公告)日：2018-05-10

申请号：US15563935

申请日：2016-03-22

Applicant: AMOGREENTECH CO., LTD.

Inventor： Hwi Chul SHIN ,  Jong Eun KIM ,  Jae Hyung SEO

IPC: H05K7/20 ,  H01Q1/02 ,  H01F27/36 ,  H01Q1/22

CPC classification number: H05K7/20 ,  H01F27/22 ,  H01F27/36 ,  H01F38/14 ,  H01Q1/02 ,  H01Q1/22 ,  H02J7/02 ,  H02J7/025 ,  H02J50/10 ,  H04B5/0031 ,  H04B5/0037

Abstract: Provided are a heat dissipation unit for wireless charging and a wireless power charging module comprising the same. The heat dissipation unit for wireless charging, according to one exemplary embodiment of the present invention, is formed of a plate-shaped substrate layer having a predetermined area to discharge to the outside heat occurring during wireless charging, and comprises at least one slot having a predetermined length. By having at least one slot, the present invention can satisfy all properties required in a wireless charging method, which are charging efficiency and a heat dissipation effect.

公开(公告)号：US20240154081A1

公开(公告)日：2024-05-09

申请号：US18281318

申请日：2022-03-10

Applicant: AMOGREENTECH CO., LTD.

Inventor： In Yong SEO ,  Dae Woo SON ,  Jae Hyung SEO

IPC: H01L33/64 ,  H01L25/16

CPC classification number: H01L33/641 ,  H01L25/167

Abstract: An insulation sheet for a display light source is provided. An insulation sheet for a display light source according to an embodiment of the present invention is provided on an opposite surface opposite to a circuit board mounting surface on which multiple LED elements configuring a light source of a display are mounted while being spaced a predetermined interval apart from each other, so as to block heat generated from the multiple LED elements from being transmitted in a direction perpendicular to the opposite surface. Accordingly, the insulation sheet can minimize vertical transfer of received heat as well as reducing the heating level of the multiple LED elements, and is thus advantageous in minimizing or preventing heat transfer in an undesirable direction and/or of an undesirable amount.

公开(公告)号：US20250079252A1

公开(公告)日：2025-03-06

申请号：US18246841

申请日：2021-09-28

Applicant: AMOGREENTECH CO., LTD.

Inventor： In Yong SEO ,  Dae Woo SON ,  Jae Hyung SEO ,  Jong Eun KIM ,  Jong Soo KIM

IPC: H01L23/367 ,  H01L23/29 ,  H01L23/373 ,  H01L25/16

Abstract: Provided is an insulation sheet for a chip on film. An insulation sheet for a chip on film according to one embodiment of the present invention is provided on the opposite surface of a printed circuit film from the surface on which a display driver IC (DDI) is mounted, and is for preventing heat generated from the display driver IC from being transferred in a direction perpendicular to the opposite surface. Accordingly, the insulation sheet for a chip on film is advantageous for lowering the temperature of the display driver IC while minimizing the transfer of received heat toward a display device housing. Moreover, due to the excellent flexibility of the insulation sheet, peeling can be prevented even when the insulation sheet is attached to a printed circuit film that is curved.