公开(公告)号：US09348088B2

公开(公告)日：2016-05-24

申请号：US14340963

申请日：2014-07-25

Applicant: ANALOG DEVICES, INC.

Inventor： James Doscher ,  Shrenik Deliwala

IPC: G02B6/42 ,  G02B6/12 ,  H01L23/544 ,  H05B7/18 ,  H05K3/30 ,  H01L31/02 ,  H01L31/167

CPC classification number: G02B6/12 ,  G02B6/4214 ,  G02B6/4231 ,  H01L23/544 ,  H01L31/02 ,  H01L31/167 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/48091 ,  H05B7/18 ,  H05K3/303 ,  H05K2201/10121 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/41 ,  Y10T29/49002 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: A method for aligning an opto-electronic component in an IC die with an optical port is disclosed. This is achieved, in various embodiments, by forming alignment features in the IC die that can mate with complementary alignment features of the optical port. The formation of alignment features can be performed at the wafer level during fabrication of the IC die. An optical signal carrier may be optically coupled to the optical port such that the signal carrier may communicate optically with the opto-electronic component.

Abstract translation: 公开了一种用于将IC管芯中的光电元件与光端口对准的方法。 这在各种实施例中通过在IC芯片中形成可与光学端口的互补对准特征匹配的对准特征来实现。 可以在IC芯片的制造期间在晶片级执行对准特征的形成。 光信号载体可以光耦合到光端口，使得信号载体可以与光电子部件光学地通信。

公开(公告)号：US20140334772A1

公开(公告)日：2014-11-13

申请号：US14340963

申请日：2014-07-25

Applicant: ANALOG DEVICES, INC.

Inventor： James Doscher ,  Shrenik Deliwala

IPC: G02B6/12 ,  H01L31/02 ,  H01L31/167

CPC classification number: G02B6/12 ,  G02B6/4214 ,  G02B6/4231 ,  H01L23/544 ,  H01L31/02 ,  H01L31/167 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/48091 ,  H05B7/18 ,  H05K3/303 ,  H05K2201/10121 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/41 ,  Y10T29/49002 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: A method for aligning an opto-electronic component in an IC die with an optical port is disclosed. This is achieved, in various embodiments, by forming alignment features in the IC die that can mate with complementary alignment features of the optical port. The formation of alignment features can be performed at the wafer level during fabrication of the IC die. An optical signal carrier may be optically coupled to the optical port such that the signal carrier may communicate optically with the opto-electronic component.

Abstract translation: 公开了一种用于将IC管芯中的光电元件与光端口对准的方法。 这在各种实施例中通过在IC芯片中形成可与光学端口的互补对准特征匹配的对准特征来实现。 可以在IC芯片的制造期间在晶片级执行对准特征的形成。 光信号载体可以光耦合到光端口，使得信号载体可以与光电子部件光学地通信。

公开(公告)号：US20250072781A1

公开(公告)日：2025-03-06

申请号：US18951164

申请日：2024-11-18

Applicant: Analog Devices, Inc.

Inventor： Venugopal GOPINATHAN ,  James Doscher ,  Tony J. Akl

IPC: A61B5/0535 ,  A61B5/00 ,  A61B5/0205 ,  A61B5/332

Abstract: Devices, systems, and methods for non-invasively detecting and monitoring medical conditions using multiple modalities of sensing include at least two electrodes configured to be positioned on a subject, an acoustic sensor configured to be positioned on a subject, a thoracic impedance measurement module connected to the electrodes, for measuring a first impedance between the electrodes, and a heart acoustic measurement module connected to the acoustic sensor, for detecting and measuring a heart sound from the acoustic sensor.

公开(公告)号：US10141107B2

公开(公告)日：2018-11-27

申请号：US14205873

申请日：2014-03-12

Applicant: Analog Devices, Inc.

Inventor： Check F. Lee ,  James Doscher

IPC: H01F5/00 ,  H01F27/02 ,  H01F27/28 ,  H01F41/04

Abstract: An inductive device may include a pair of half-shell magnetically-conductive housings joined together and defining an enclosed cavity between them. The inductive device may also include primary and secondary windings provided spatially within the cavity providing magnetic coupling between them. The windings may be electrically insulated from each other and terminals of the primary and secondary windings may traverse to an exterior of the inductive device.