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公开(公告)号：US20180059044A1
公开(公告)日：2018-03-01
申请号：US15251833
申请日：2016-08-30
发明人： Alfonso Berduque , Helen Berney , William Allan Lane , Raymond J. Speer , Brendan Cawley , Donal Mcauliffe , Patrick Martin McGuinness
IPC分类号： G01N27/403
CPC分类号： G01N27/403 , G01N27/4045
摘要： An electrochemical sensor is provided which may be formed using micromachining techniques commonly used in the manufacture of integrated circuits. This is achieved by forming microcapillaries in a silicon substrate and forming an opening in an insulating layer to allow environmental gases to reach through to the top side of the substrate. A porous electrode is printed on the top side of the insulating layer such that the electrode is formed in the opening in the insulating layer. The sensor also comprises at least one additional electrode. The electrolyte is then formed on top of the electrodes. A cap is formed over the electrodes and electrolyte. This arrangement may easily be produced using micromachining techniques.
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公开(公告)号：US10288582B2
公开(公告)日：2019-05-14
申请号：US14993871
申请日：2016-01-12
IPC分类号： G01N27/414
摘要： An integrated ion-sensitive probe is provided. In an example, an ion-sensitive probe can include a semiconductor substrate and a first passive electrode attached to the semiconductor substrate. The first passive electrode can be configured to contact a solution and to provide a first electrical voltage as function of a concentration of an ion within the solution. In certain examples, a passive reference electrode can be co-located on the semiconductor substrate. In some examples, processing electronics can be integrated on the semiconductor substrate.
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公开(公告)号：US10672968B2
公开(公告)日：2020-06-02
申请号：US14805135
申请日：2015-07-21
摘要： An embodiment of a thermoelectric device may include a plurality of thermoelectric cells disposed between first and second planes. Each of the thermoelectric cells may include a thermoelectric element formed from a thermoelectric material of a single semiconductor type, the thermoelectric element including a first end, a second end, and a portion extending from the first end to the second end, the portion extending from the first end to the second end including at least two surfaces that face each other; and at least one conductive element electrically connected to and extending away from the second end of the thermoelectric element toward the first end of the thermoelectric element of another thermoelectric cell. Each thermoelectric cell also may further include an insulating element disposed between the at least two surfaces of the thermoelectric element and between portions of the at least one conductive element.
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公开(公告)号：US20200072783A1
公开(公告)日：2020-03-05
申请号：US16613584
申请日：2018-05-15
发明人： Helen Berney , Alan O'Donnell , Thomas O'Dwyer , Alfonso Berduque
IPC分类号： G01N27/333 , G01N27/416 , G01N27/414
摘要： An integrated ion-sensitive probe is provided. In an example, an ion-sensitive probe can include a semiconductor substrate and a first passive electrode attached to the semiconductor substrate. The first passive electrode can be configured to contact a solution and to provide a first electrical voltage as function of a concentration of an ion within the solution. In certain examples, a passive reference electrode can be co-located on the semiconductor substrate. In some examples, processing electronics can be integrated on the semiconductor substrate.
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公开(公告)号：US20190195825A1
公开(公告)日：2019-06-27
申请号：US16329664
申请日：2017-08-29
发明人： Alfonso Berduque , Helen Berney , William Allan Lane , Raymond J. Speer , Brendan Cawley , Donal McAuliffe , Patrick Martin McGuinness
IPC分类号： G01N27/407 , G01N27/30
CPC分类号： G01N27/407 , G01N27/304
摘要： An electrochemical sensor is provided which may be formed using micromachining techniques commonly used in the manufacture of integrated circuits. This is achieved by forming microcapillaries in a silicon substrate and forming an opening in an insulating layer to allow environmental gases to reach through to the top side of the substrate. A porous electrode is printed on the top side of the insulating layer such that the electrode is formed in the opening in the insulating layer. The sensor also comprises at least one additional electrode. The electrolyte is then formed on top of the electrodes. A cap is formed over the electrodes and electrolyte. This arrangement may easily be produced using micromachining techniques.
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