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公开(公告)号：US20190039883A1
公开(公告)日：2019-02-07
申请号：US15666475
申请日：2017-08-01
Applicant: Analog Devices Global
Inventor： Baoxing Chen , William Allan Lane , Marc T. Dunham
IPC: B81B7/00 , H01L23/427 , H01L23/367
Abstract: A monolithic vapor chamber heat dissipating device uses a phase change liquid and one or more wicks to dissipate heat from a heat-generating system. The phase change liquid and one or more wicks may be directly coupled to the heat-generating system, or may be coupled to an intermediate evaporator substrate. The phase change liquid vaporizes as it absorbs heat from the heat-generating system. When the vapor rises and encounters a condenser substrate, the vapor condenses and transfers the heat to the condenser substrate. The condensed vapor is drawn by gravity and the one or more wicks to the phase change liquid coupled to the heat-generating system.
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公开(公告)号：US20180059044A1
公开(公告)日：2018-03-01
申请号：US15251833
申请日：2016-08-30
Applicant: Analog Devices Global
Inventor： Alfonso Berduque , Helen Berney , William Allan Lane , Raymond J. Speer , Brendan Cawley , Donal Mcauliffe , Patrick Martin McGuinness
IPC: G01N27/403
CPC classification number: G01N27/403 , G01N27/4045
Abstract: An electrochemical sensor is provided which may be formed using micromachining techniques commonly used in the manufacture of integrated circuits. This is achieved by forming microcapillaries in a silicon substrate and forming an opening in an insulating layer to allow environmental gases to reach through to the top side of the substrate. A porous electrode is printed on the top side of the insulating layer such that the electrode is formed in the opening in the insulating layer. The sensor also comprises at least one additional electrode. The electrolyte is then formed on top of the electrodes. A cap is formed over the electrodes and electrolyte. This arrangement may easily be produced using micromachining techniques.
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3.发明授权Semiconductor device, and a method of improving breakdown voltage of a semiconductor device 有权半导体装置以及提高半导体装置的击穿电压的方法公开(公告)号：US09252260B2
公开(公告)日：2016-02-02
申请号：US13939556
申请日：2013-07-11
Applicant: ANALOG DEVICES GLOBAL
Inventor： Edward John Coyne , Breandan Pol Og O hAnnaidh , Seamus P. Whiston , William Allan Lane , Donai P. McAuliffe
CPC classification number: H01L29/78 , H01L29/063 , H01L29/0878 , H01L29/1083 , H01L29/1095 , H01L29/402 , H01L29/404 , H01L29/42368 , H01L29/66477 , H01L29/66681 , H01L29/7824
Abstract: A semiconductor device having a first layer adjoining a semiconductor layer, and further comprising at least one field modification structure positioned such that, in use, a potential at the field modification structure causes an E-field vector at a region of an interface between the semiconductor and the first layer to be modified.
Abstract translation: 一种半导体器件，其具有与半导体层相邻的第一层，并且还包括至少一个场修改结构，其定位使得在使用中，场修改结构处的电位在半导体的界面区域处引起E场矢量 和要修改的第一层。
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公开(公告)号：US10148263B2
公开(公告)日：2018-12-04
申请号：US15216498
申请日：2016-07-21
Applicant: Analog Devices Global Unlimited Company
IPC: H01L29/66 , H03K17/795 , H03K19/003 , H03K17/567 , H01L27/06 , H02M7/217 , H02M7/537 , H02P27/06 , H03K17/06
Abstract: A combined isolator and power switch is disclosed. Such devices are useful in isolating low voltage components such as control compilers from motors or generators working at high voltages. The combined isolator and power switch includes circuits to transfer internal power from its low voltage side to the switch driver circuits on the high voltage side. The combined isolator and switch is compact and easy to use.
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公开(公告)号：US10597286B2
公开(公告)日：2020-03-24
申请号：US15666475
申请日：2017-08-01
Applicant: Analog Devices Global
Inventor： Baoxing Chen , William Allan Lane , Marc T. Dunham
IPC: B81B7/00 , H01L23/427 , H01L23/367 , H01L23/373
Abstract: A monolithic vapor chamber heat dissipating device uses a phase change liquid and one or more wicks to dissipate heat from a heat-generating system. The phase change liquid and one or more wicks may be directly coupled to the heat-generating system, or may be coupled to an intermediate evaporator substrate. The phase change liquid vaporizes as it absorbs heat from the heat-generating system. When the vapor rises and encounters a condenser substrate, the vapor condenses and transfers the heat to the condenser substrate. The condensed vapor is drawn by gravity and the one or more wicks to the phase change liquid coupled to the heat-generating system.
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Patent Agency Ranking
公开(公告)号：US10288582B2
公开(公告)日：2019-05-14
申请号：US14993871
申请日：2016-01-12
Applicant: Analog Devices Global
Inventor： Helen Berney , William Allan Lane , Patrick Martin McGuinness , Thomas G. O'Dwyer
IPC: G01N27/414
Abstract: An integrated ion-sensitive probe is provided. In an example, an ion-sensitive probe can include a semiconductor substrate and a first passive electrode attached to the semiconductor substrate. The first passive electrode can be configured to contact a solution and to provide a first electrical voltage as function of a concentration of an ion within the solution. In certain examples, a passive reference electrode can be co-located on the semiconductor substrate. In some examples, processing electronics can be integrated on the semiconductor substrate.
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公开(公告)号：US20170279444A1
公开(公告)日：2017-09-28
申请号：US15216498
申请日：2016-07-21
Applicant: Analog Devices Global
IPC: H03K17/567 , H02P27/06 , H02M7/217 , H01L27/06 , H02M7/537
CPC classification number: H03K17/567 , H01L27/0623 , H02M7/217 , H02M7/537 , H02P27/06 , H03K17/06 , H03K2017/066
Abstract: A combined isolator and power switch is disclosed. Such devices are useful in isolating low voltage components such as control compilers from motors or generators working at high voltages. The combined isolator and power switch includes circuits to transfer internal power from its low voltage side to the switch driver circuits on the high voltage side. The combined isolator and switch is compact and easy to use.
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公开(公告)号：US09484739B2
公开(公告)日：2016-11-01
申请号：US14496839
申请日：2014-09-25
Applicant: ANALOG DEVICES GLOBAL
Inventor： Edward John Coyne , John Twomey , Seamus P. Whiston , David J. Clarke , Donal P. McAuliffe , William Allan Lane , Stephen Denis Heffernan , Brian A. Moane , Brian Michael Sweeney , Patrick Martin McGuinness
CPC classification number: H02H9/044 , H01L27/0259 , H02H7/16
Abstract: A protection device is provided that exhibits a turn on time of order of one nanosecond or less. Such a device provides enhanced protection for integrated circuits against electrostatic discharge events. This in turn reduces the risk of device failure in use. The protection device can include a bipolar transistor structure connected between a node to be protected and a discharge path.
Abstract translation: 提供一种保护装置，其展现了一纳秒或更少的转动时间。 这样一种器件为集成电路提供了防止静电放电事件的增强保护。 这反过来又降低了使用设备故障的风险。 保护装置可以包括连接在要保护的节点和放电路径之间的双极晶体管结构。
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公开(公告)号：US20150233857A1
公开(公告)日：2015-08-20
申请号：US14183046
申请日：2014-02-18
Applicant: ANALOG DEVICES GLOBAL
Inventor： Paul Martin Lambkin , William Allan Lane
Abstract: Methods, devices and electronic components are disclosed, including a method of testing an integrity of a reduced gas pressure region at at least part of an electronic device, the method comprising applying a first current or voltage to a conductor, wherein the conductor includes at least one thermocouple formed on the device, and measuring an electrical property of the device.
Abstract translation: 公开了方法，装置和电子部件，包括在电子装置的至少一部分处测试降低的气体压力区域的完整性的方法，所述方法包括向导体施加第一电流或电压，其中所述导体至少包括 一个热电偶形成在器件上，并测量器件的电气特性。
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公开(公告)号：US20190195825A1
公开(公告)日：2019-06-27
申请号：US16329664
申请日：2017-08-29
Applicant: ANALOG DEVICES GLOBAL
Inventor： Alfonso Berduque , Helen Berney , William Allan Lane , Raymond J. Speer , Brendan Cawley , Donal McAuliffe , Patrick Martin McGuinness
IPC: G01N27/407 , G01N27/30
CPC classification number: G01N27/407 , G01N27/304
Abstract: An electrochemical sensor is provided which may be formed using micromachining techniques commonly used in the manufacture of integrated circuits. This is achieved by forming microcapillaries in a silicon substrate and forming an opening in an insulating layer to allow environmental gases to reach through to the top side of the substrate. A porous electrode is printed on the top side of the insulating layer such that the electrode is formed in the opening in the insulating layer. The sensor also comprises at least one additional electrode. The electrolyte is then formed on top of the electrodes. A cap is formed over the electrodes and electrolyte. This arrangement may easily be produced using micromachining techniques.
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