公开(公告)号：US20130285263A1

公开(公告)日：2013-10-31

申请号：US13632145

申请日：2012-09-30

Applicant: APPLE INC.

Inventor： Shawn X. ARNOLD ,  Terry L. GILTON ,  Matthew LAST

IPC: H01L23/498 ,  H01L21/308

CPC classification number: H05K1/183 ,  G06F1/16 ,  G06F3/041 ,  G06K9/00053 ,  H01L23/24 ,  H01L24/11 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L29/0657 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48479 ,  H01L2224/85 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10253 ,  H05K1/111 ,  H05K2201/09036 ,  H05K2201/10151 ,  H01L2924/20752 ,  H01L2224/48471 ,  H01L2224/4554

Abstract: A sensor array package can include a sensor disposed on a first side of a substrate. Signal trenches can be formed along the edges of the substrate and a conductive layer can be deposited in the signal trench and can couple to sensor signal pads. Bond wires can be attached to the conductive layers and can be arranged to be below a surface plane of the sensor. The sensor array package can be embedded in a printed circuit board enabling the bond wires to terminate at other conductors within the printed circuit board.