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公开(公告)号:US09680249B2
公开(公告)日:2017-06-13
申请号:US15282768
申请日:2016-09-30
Applicant: Apple Inc.
Inventor: Peter A. Dvorak , Siri Amrit Ramos , Xuyang Zhang , Cesar Lozano Villarreal , Ciaran J. Keane , Alexander M. Kwan
IPC: H01R43/24 , H01R31/06 , H01R13/516 , H01B17/64 , H01R13/504 , H01R43/18 , H01R13/66
CPC classification number: H01R13/504 , H01R13/665 , H01R31/065 , H01R43/18
Abstract: An enclosure for an AC to DC adapter has a continuous and seamless exterior surface. The enclosure includes a housing and a front wall that are joined by a bonded interface. The front wall is formed from a metallic interface plate and an exterior layer of plastic that is formed over the metallic interface plate and bonded to the housing.
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公开(公告)号:US20240079778A1
公开(公告)日:2024-03-07
申请号:US18458720
申请日:2023-08-30
Applicant: Apple Inc.
Inventor: Enrique Ayala Vazquez , Ming-Ju Tsai , Yiren Wang , Yuan Tao , Hao Xu , Sidharath Jain , Haozhan Tian , Yuancheng Xu , Eric W. Bates , Peter A. Dvorak , Harlan S. Dannenberg , Rees S. Parker , Obinna O. Onyemepu , Victor C. Lee , Han Wang , Hongfei Hu
CPC classification number: H01Q5/328 , H01Q9/0442 , H01Q9/045
Abstract: An electronic device may be provided with an antenna having a resonating element formed from a segment of peripheral conductive housing structures. A speaker may be aligned with first openings in the segment. A vent may be aligned with second openings in the segment. A connector may protrude through the segment. A trace combiner for the antenna may be patterned onto the speaker and may be coupled to the segment. Tuners for the antenna may be disposed on first and second flexible printed circuits that extend along opposing sides of the connector. The tuners may be controlled through the speaker. The second flexible printed circuit may extend along the vent. The vent may have a vent cowling with a cut-out region next to the tuner on the second flexible printed circuit.
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公开(公告)号:US20170093078A1
公开(公告)日:2017-03-30
申请号:US15282768
申请日:2016-09-30
Applicant: Apple Inc.
Inventor: Peter A. Dvorak , Siri Amrit Ramos , Xuyang Zhang , Cesar Lozano Villarreal , Ciaran J. Keane , Alexander M. Kwan
IPC: H01R13/504 , H01R31/06 , H01R13/66 , H01R43/18
CPC classification number: H01R13/504 , H01R13/665 , H01R31/065 , H01R43/18
Abstract: An enclosure for an AC to DC adapter has a continuous and seamless exterior surface. The enclosure includes a housing and a front wall that are joined by a bonded interface. The front wall is formed from a metallic interface plate and an exterior layer of plastic that is formed over the metallic interface plate and bonded to the housing.
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公开(公告)号:US20240080976A1
公开(公告)日:2024-03-07
申请号:US18458747
申请日:2023-08-30
Applicant: Apple Inc.
Inventor: Peter A. Dvorak , Eric W. Bates , Ana Papio Toda , Yiren Wang , Hao Xu , Yuan Tao , Han Wang , Jack R Lanzi , Ronald Lam
CPC classification number: H05K1/11 , H05K1/028 , H05K1/181 , H05K5/0217 , H05K7/1427 , H04R1/02 , H05K2201/0141 , H05K2201/10098 , H05K2201/10128
Abstract: An electronic device may be provided with a liquid crystal polymer (LCP) printed circuit having conductive trace and a hole. A conductive flange may be soldered to the conductive trace and may extend into the hole. The end of the conductive flange may laterally surround a central opening within the hole. A conductive contact may be inserted into the central opening. Solder may be deposited over the conductive flange and in the central opening. The solder may couple the conductive contact to the conductive flange and thus the conductive trace. This may ensure a robust mechanical and electrical connection between the conductive contact and the conductive trace on the printed circuit despite the printed circuit being formed from LCP, which may not support copper-plated through vias for coupling to the conductive contact.
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公开(公告)号:US20240079785A1
公开(公告)日:2024-03-07
申请号:US18458811
申请日:2023-08-30
Applicant: Apple Inc.
Inventor: Yiren Wang , Yuan Tao , Hao Xu , Yuancheng Xu , Enrique Ayala Vazquez , Nikolaj P. Kammersgaard , Eric W. Bates , Peter A. Dvorak , Victor C. Lee , Han Wang
IPC: H01Q9/04
CPC classification number: H01Q9/0421 , H01Q1/243
Abstract: An electronic device may be provided with an antenna having a resonating element formed from a segment of peripheral conductive housing structures. A speaker may be aligned with first openings in the segment. A vent may be aligned with second openings in the segment. A connector may protrude through the segment. A trace combiner for the antenna may be patterned onto the speaker and may be coupled to the segment. Tuners for the antenna may be disposed on first and second flexible printed circuits that extend along opposing sides of the connector. The tuners may be controlled through the speaker. The second flexible printed circuit may extend along the vent. The vent may have a vent cowling with a cut-out region next to the tuner on the second flexible printed circuit.
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公开(公告)号:US20240079779A1
公开(公告)日:2024-03-07
申请号:US18458779
申请日:2023-08-30
Applicant: Apple Inc.
Inventor: Yuan Tao , Yiren Wang , Ana Papio Toda , Jingni Zhong , Han Wang , Hao Xu , Hongfei Hu , Mattia Pascolini , Eric W. Bates , Peter A. Dvorak , Allegra Shum
CPC classification number: H01Q5/328 , H01Q9/0442
Abstract: An electronic device may be provided with a sensor module and an antenna having an antenna arm, ground structures, and a tuner. The tuner may be mounted to a printed circuit overlapping the sensor module. A spring may be mounted to the printed circuit and may couple the tuner to a conductive chassis of the sensor module. The sensor module may include optical sensors that gather sensor data through a display and may form ground paths from the tuner to the ground structures. Conductive interconnect structures such as springs may exert biasing forces in different directions to couple the ground paths to different layers of the ground structures. This may serve to couple the antenna to the ground structures as close as possible to the tuner, thereby maximizing antenna performance, despite the presence of the sensor module.
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公开(公告)号:US11516929B2
公开(公告)日:2022-11-29
申请号:US16996795
申请日:2020-08-18
Applicant: Apple Inc.
Inventor: Peter A. Dvorak , Jeremy M. Dahl , Michael A. Foote , Brian K. Thorne , Cesar Lozano Villarreal
Abstract: A power adapter is disclosed. The power adapter includes housing parts that carries electronic components. To secure the housing parts together, one housing part includes snaps and another housing part includes protrusions and rails. During assembly, the protrusions slide under the snap, causing the snap to deflect in one direction, while the rails slide over the snap, which keeps the snap partially flat but also causes the snap to deflect in another direction. The engagement (during assembly) of the rails and the protrusions to opposing surfaces of the snap cause bi-directional deflection/bending of the snap. When each protrusion is positioned into an opening of the snap, the snap returns to a flat, non-deflected state, and the housing parts are secured together by the snap, protrusions, and rails. The rails support the snaps by limiting or preventing additional deflection of the snap, which subsequently promotes the housing remaining together.
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公开(公告)号:US09882302B2
公开(公告)日:2018-01-30
申请号:US15282750
申请日:2016-09-30
Applicant: APPLE INC.
Inventor: Alexander M. Kwan , Cesar Lozano Villarreal , Siri Amrit Ramos , Xuyang Zhang , Peter A. Dvorak
CPC classification number: H01R13/504 , B29C65/08 , B29C66/1162 , B29C66/1222 , B29C66/1224 , B29C66/1226 , B29C66/124 , B29C66/1248 , B29C66/53461 , B29C66/71 , B29C66/73921 , B29C66/8322 , B29L2031/3481 , B29L2031/36 , H01R13/5045 , H01R13/521 , H01R13/665 , H01R27/02 , H01R43/18 , B29K2069/00
Abstract: An enclosure for an AC to DC adapter has a continuous and apparently seamless exterior surface. The enclosure includes a housing and a cap that are joined by a pair of weld joints. One weld is formed on an interior portion of the enclosure providing strength and one weld joint is formed on the exterior surface providing a seamless appearance for the enclosure.
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公开(公告)号:US20170093077A1
公开(公告)日:2017-03-30
申请号:US15282750
申请日:2016-09-30
Applicant: APPLE INC.
Inventor: Alexander M. Kwan , Cesar Lozano Villarreal , Siri Amrit Ramos , Xuyang Zhang , Peter A. Dvorak
IPC: H01R13/504 , H01R13/66 , H01R43/18
CPC classification number: H01R13/504 , B29C65/08 , B29C66/1162 , B29C66/1222 , B29C66/1224 , B29C66/1226 , B29C66/124 , B29C66/1248 , B29C66/53461 , B29C66/71 , B29C66/73921 , B29C66/8322 , B29L2031/3481 , B29L2031/36 , H01R13/5045 , H01R13/521 , H01R13/665 , H01R27/02 , H01R43/18 , B29K2069/00
Abstract: An enclosure for an AC to DC adapter has a continuous and apparently seamless exterior surface. The enclosure includes a housing and a cap that are joined by a pair of weld joints. One weld is formed on an interior portion of the enclosure providing strength and one weld joint is formed on the exterior surface providing a seamless appearance for the enclosure.
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