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公开(公告)号:US12238469B2
公开(公告)日:2025-02-25
申请号:US18626112
申请日:2024-04-03
Applicant: APPLE INC.
Inventor: Edward Siahaan , Daniel R. Bloom , Jason J. LeBlanc , Phillip Qian
IPC: H04R25/00 , H04R1/10 , H04R5/033 , H04R5/04 , G10K11/178
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号:US20210105553A1
公开(公告)日:2021-04-08
申请号:US17104830
申请日:2020-11-25
Applicant: Apple Inc.
Inventor: Phillip Qian , Edward Siahaan , Erik L. Wang , Christopher J. Stringer , Matthew Dean Rohrbach , Daniel Max Strongwater , Jason J. LeBlanc
Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.
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公开(公告)号:US20200280786A1
公开(公告)日:2020-09-03
申请号:US16878556
申请日:2020-05-19
Applicant: Apple Inc.
Inventor: Jared M. Kole , Daniel R. Bloom , Audrey L. Sheng , Tian Shi Li , Eugene Antony Whang , Edward Siahaan , Phillip Qian , Alex C. Hellwig , Oliver M. Hewitt , Yuta Kuboyama , Christopher S. Erickson , Sneha Kadetotad , Edwin J. Corona Aparicio , Rajesh Anantharaman , Jacob E. Mattingley , Tsu-Hui Lin , Robert D. Zupke , Dustin A. Hatfield , Axit H. Patel
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号:US20170094387A1
公开(公告)日:2017-03-30
申请号:US15253794
申请日:2016-08-31
Applicant: Apple Inc.
Inventor: Ethan L. Huwe , Brad G. Boozer , Erik L. Wang , Phillip Qian
IPC: H04R1/10
CPC classification number: H04R1/1016 , H04R1/1058
Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.
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公开(公告)号:US09602911B1
公开(公告)日:2017-03-21
申请号:US14856344
申请日:2015-09-16
Applicant: Apple Inc.
Inventor: Phillip Qian , Edward Siahaan , Scott C. Grinker , Jason J. LeBlanc
Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be positioned within.
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公开(公告)号:US20160316285A1
公开(公告)日:2016-10-27
申请号:US14695357
申请日:2015-04-24
Applicant: APPLE INC.
Inventor: Phillip Qian , Edward Siahaan , Erik L. Wang , Esge B. Andersen
CPC classification number: H04R1/086
Abstract: An acoustic device such as a microphone or speaker is positioned with and coupled to a housing to connect an acoustic port of the acoustic device with an external opening of the housing. A reservoir is connected to the external opening via a bleed channel. The bleed channel may be less resistive to liquid ingress than the acoustic port. As such, the reservoir and bleed channel may redirect liquid from the external opening away from the acoustic port. In some implementations, the reservoir and/or the bleed channel may be defined by one or more acoustically permeable barriers such as meshes that cover the acoustic port, compressible materials such as foams that form a perimeter around the acoustic port, and/or adhesive layers that couple the acoustic device, the housing, and/or one or more other components.
Abstract translation: 诸如麦克风或扬声器之类的声学装置被定位并连接到壳体,以将声学装置的声学接口与壳体的外部开口相连接。 储液器通过排放通道连接到外部开口。 泄放通道可能比声学端口对液体进入的阻力更小。 因此,储存器和排出通道可以将液体从外部开口转向远离声学端口。 在一些实施方案中,储存器和/或排放通道可以由一个或多个声透过性屏障限定,例如覆盖声学端口的网孔,可压缩材料,例如围绕声学端口形成周边的泡沫,和/或粘合剂层 耦合声学装置,壳体和/或一个或多个其它部件。
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公开(公告)号:US20250063289A1
公开(公告)日:2025-02-20
申请号:US18936243
申请日:2024-11-04
Applicant: APPLE INC.
Inventor: Phillip Qian , Edward Siahaan , Erik L. Wang , Christopher J. Stringer , Matthew Dean Rohrbach , Daniel Max Strongwater , Jason J. LeBlanc
IPC: H04R1/10 , A61B5/00 , A61B5/01 , A61B5/024 , A61B5/1455 , H04R1/40 , H04R3/00 , H04R5/033 , H04R5/04
Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.
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公开(公告)号:US20220369015A1
公开(公告)日:2022-11-17
申请号:US17878767
申请日:2022-08-01
Applicant: APPLE INC.
Inventor: Edward Siahaan , Daniel R. Bloom , Lee M. Panecki , Phillip Qian , Benjamin A. Shaffer , Christopher J. Stringer , Eugene A. Whang , David H. Narajowski , Scott Y. Oshita , Dustin A. Hatfield , Zachary G. Segraves , Sean J. Docherty
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号:US11503399B2
公开(公告)日:2022-11-15
申请号:US17242182
申请日:2021-04-27
Applicant: Apple Inc.
Inventor: Mei Zhang , Benjamin A. Cousins , Mohammad Soroush Ghahri Sarabi , Phillip Qian , Sean T. McIntosh , Michael B. Minerbi , Lee M. Panecki
IPC: H04R1/10
Abstract: A wireless earphone comprising a housing that defines an interior cavity having an inner surface and an outer surface; an opening extending through the housing from the inner surface to the outer surface; and a mesh assembly disposed over the opening and comprising a permanent assembly coupled to the housing and a replaceable assembly removably coupled to the permanent assembly and comprising a mesh.
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公开(公告)号:US20200177983A1
公开(公告)日:2020-06-04
申请号:US16780881
申请日:2020-02-03
Applicant: Apple Inc.
Inventor: Ethan L. Huwe , Brad G. Boozer , Erik L. Wang , Phillip Qian
IPC: H04R1/10
Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.
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