公开(公告)号：US20130285240A1

公开(公告)日：2013-10-31

申请号：US13842092

申请日：2013-03-15

Applicant: APPLE INC.

Inventor： Matthew E. LAST ,  Lili HUANG ,  Seung Jae HONG ,  Ralph E. KAUFFMAN ,  Tongbi Tom JIANG

IPC: H01L23/48 ,  H01L21/48

CPC classification number: H01L23/481 ,  H01L21/485 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/04042 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48479 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/48471 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A sensor array package can include a sensor disposed on a first side of a substrate. Signal trenches can be formed along the edges of the substrate and a conductive layer can be deposited in the signal trench and can couple to sensor signal pads. Bond wires can be attached to the conductive layers and can be arranged to be below a surface plane of the sensor. The sensor array package can be embedded in a printed circuit board enabling the bond wires to terminate at other conductors within the printed circuit board.

Abstract translation: 传感器阵列封装可以包括设置在基板的第一侧上的传感器。 信号沟槽可以沿着衬底的边缘形成，并且导电层可以沉积在信号沟槽中并且可以耦合到传感器信号焊盘。 接合线可以附接到导电层并且可以被布置成在传感器的表面下方。 传感器阵列封装可嵌入印刷电路板中，使得接合线能够终止于印刷电路板内的其它导体。