公开(公告)号：US20140218841A1

公开(公告)日：2014-08-07

申请号：US13872000

申请日：2013-04-26

Applicant: APPLE INC.

Inventor： Gang NING ,  Shawn Xavier ARNOLD ,  Jeffrey M. THOMA ,  Henry H. YANG

IPC: H01G4/35

CPC classification number: H01G4/35 ,  H01G4/2325 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/10015

Abstract: The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (PCB) and more specifically to designs for mechanically isolating the capacitor assembly from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Termination elements in the capacitor assembly, including a porous conductive layer in the capacitor assembly may reduce an amount of vibrational energy transferred from the capacitor to the PCB. Termination elements including a soft contact layer may also reduce the amount of vibrational energy transferred to the PCB. Further, capacitor assemblies having thickened dielectric material may reduce the amount of vibrational energy transferred to the PCB.

Abstract translation: 所描述的实施例通常涉及用于安装在印刷电路板（PCB）上的电容器组件，更具体地涉及用于将电容器组件与PCB机械隔离的设计，以减少当电容器在PCB上施加压电力时产生的声学噪声。 电容器组件中的终端元件，包括电容器组件中的多孔导电层可以减少从电容器传递到PCB的振动能量。 包括软接触层的端接元件也可以减少传递到PCB的振动能量。 此外，具有增厚的介电材料的电容器组件可以减少传递到PCB的振动能量。