公开(公告)号：US20150310991A1

公开(公告)日：2015-10-29

申请号：US14265147

申请日：2014-04-29

Applicant: Apple Inc.

Inventor： Gang NING ,  Shawn X. ARNOLD

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/012

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G13/00

Abstract: This application relates to multi-layered ceramic capacitors (MLCC) that can be surface mounted, include multiple terminals, and handle multiple voltages. The MLCC can include electrode and dielectric layers that are stacked in parallel to a printed circuit board (PCB) on which the MLCC can be attached. A set of primary conductive pads can be formed on the bottom of the MLCC in order to create a conductive interface between the PCB and the MLCC. Secondary conductive pads are formed on the side of the MLCC, and can extend perpendicular to the PCB. The secondary conductive pads are created by stacking internal electrode plates together and connecting them electrically and mechanically to each another. This arrangement provides for multiple voltages and electrical connections at the MLCC while reducing reverse piezoelectric and/or electro-striction noise.

Abstract translation: 本申请涉及可以表面安装的多层陶瓷电容器（MLCC），包括多个端子，并处理多个电压。 MLCC可以包括与可以连接MLCC的印刷电路板（PCB）平行堆叠的电极和电介质层。 可以在MLCC的底部形成一组主导电焊盘，以便在PCB和MLCC之间形成导电接口。 二次导电焊盘形成在MLCC的侧面，并可垂直于PCB延伸。 通过将内部电极板堆叠在一起并将它们彼此电连接和机械地连接而产生次级导电焊盘。 这种布置在MLCC处提供多个电压和电连接，同时减少反向压电和/或电摩擦噪声。

公开(公告)号：US20140218841A1

公开(公告)日：2014-08-07

申请号：US13872000

申请日：2013-04-26

Applicant: APPLE INC.

Inventor： Gang NING ,  Shawn Xavier ARNOLD ,  Jeffrey M. THOMA ,  Henry H. YANG

IPC: H01G4/35

CPC classification number: H01G4/35 ,  H01G4/2325 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/10015

Abstract: The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (PCB) and more specifically to designs for mechanically isolating the capacitor assembly from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Termination elements in the capacitor assembly, including a porous conductive layer in the capacitor assembly may reduce an amount of vibrational energy transferred from the capacitor to the PCB. Termination elements including a soft contact layer may also reduce the amount of vibrational energy transferred to the PCB. Further, capacitor assemblies having thickened dielectric material may reduce the amount of vibrational energy transferred to the PCB.

Abstract translation: 所描述的实施例通常涉及用于安装在印刷电路板（PCB）上的电容器组件，更具体地涉及用于将电容器组件与PCB机械隔离的设计，以减少当电容器在PCB上施加压电力时产生的声学噪声。 电容器组件中的终端元件，包括电容器组件中的多孔导电层可以减少从电容器传递到PCB的振动能量。 包括软接触层的端接元件也可以减少传递到PCB的振动能量。 此外，具有增厚的介电材料的电容器组件可以减少传递到PCB的振动能量。