公开(公告)号：US20140076621A1

公开(公告)日：2014-03-20

申请号：US13957342

申请日：2013-08-01

Applicant: Apple Inc.

Inventor： Shawn X. ARNOLD ,  Jeffrey M. THOMA ,  Connor R. DUKE ,  Yanchu XU ,  Nelson J. KOTTKE

IPC: H01G4/01 ,  H05K13/04 ,  B23K26/22 ,  H05K1/18

CPC classification number: H01G4/01 ,  B23K26/22 ,  H01G2/06 ,  H01G2/10 ,  H01G4/224 ,  H01G4/228 ,  H01G4/40 ,  H05K1/181 ,  H05K3/3442 ,  H05K13/0465 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10962 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.

Abstract translation: 所描述的实施例通常涉及包括电容器的印刷电路板（PCB），更具体地涉及用于将电容器与PCB机械隔离的设计，以减少当电容器在PCB上施加压电力时产生的声学噪声。 导电特征可以机械地和电耦合到位于电容器两端的电极。 导电特征可以放置在由压电力产生的振动幅度相对较小的拐角处。 然后可以将导电特征焊接到PCB上的焊盘图案以形成机械和电连接，同时减少从电容器传递到PCB的振动能量的数量。

公开(公告)号：US20140218841A1

公开(公告)日：2014-08-07

申请号：US13872000

申请日：2013-04-26

Applicant: APPLE INC.

Inventor： Gang NING ,  Shawn Xavier ARNOLD ,  Jeffrey M. THOMA ,  Henry H. YANG

IPC: H01G4/35

CPC classification number: H01G4/35 ,  H01G4/2325 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/10015

Abstract: The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (PCB) and more specifically to designs for mechanically isolating the capacitor assembly from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Termination elements in the capacitor assembly, including a porous conductive layer in the capacitor assembly may reduce an amount of vibrational energy transferred from the capacitor to the PCB. Termination elements including a soft contact layer may also reduce the amount of vibrational energy transferred to the PCB. Further, capacitor assemblies having thickened dielectric material may reduce the amount of vibrational energy transferred to the PCB.

Abstract translation: 所描述的实施例通常涉及用于安装在印刷电路板（PCB）上的电容器组件，更具体地涉及用于将电容器组件与PCB机械隔离的设计，以减少当电容器在PCB上施加压电力时产生的声学噪声。 电容器组件中的终端元件，包括电容器组件中的多孔导电层可以减少从电容器传递到PCB的振动能量。 包括软接触层的端接元件也可以减少传递到PCB的振动能量。 此外，具有增厚的介电材料的电容器组件可以减少传递到PCB的振动能量。