公开(公告)号：US20190051551A1

公开(公告)日：2019-02-14

申请号：US16121844

申请日：2018-09-05

Applicant: APPLIED MATERIALS, INC.

Inventor： XING LIN ,  DOUGLAS A. BUCHBERGER, JR. ,  XIAOPING ZHOU ,  ANDREW NGUYEN ,  ANCHEL SHEYNER

IPC: H01L21/683 ,  H01L21/67 ,  H01J37/32

Abstract: Apparatus for processing a substrate is disclosed herein. In some embodiments, a substrate support may include a substrate support having a support surface for supporting a substrate the substrate support having a central axis; a first electrode disposed within the substrate support to provide RF power to a substrate when disposed on the support surface; an inner conductor coupled to the first electrode about a center of a surface of the first electrode opposing the support surface, wherein the inner conductor is tubular and extends from the first electrode parallel to and about the central axis in a direction away from the support surface of the substrate support; an outer conductor disposed about the inner conductor; and an outer dielectric layer disposed between the inner and outer conductors, the outer dielectric layer electrically isolating the outer conductor from the inner conductor. The outer conductor may be coupled to electrical ground.

公开(公告)号：US20160169593A1

公开(公告)日：2016-06-16

申请号：US15050419

申请日：2016-02-22

Applicant: APPLIED MATERIALS, INC.

Inventor： KALLOL BERA ,  XIAOPING ZHOU ,  DOUGLAS A. BUCHBERGER, JR. ,  ANDREW NGUYEN ,  HAMID TAVASSOLI ,  SURAJIT KUMAR ,  SHAHID RAUF

IPC: F28F3/12

CPC classification number: F28F3/12 ,  F28F2013/001

Abstract: Apparatus for controlling the thermal uniformity of a substrate are provided. The thermal uniformity of the substrate may be controlled to be more uniform or the thermal uniformity of the substrate may be controlled to be non-uniform in a desired pattern. In some embodiments, an apparatus for controlling the thermal uniformity of a substrate includes: a substrate support having a support surface to support a substrate thereon; and a flow path disposed within the substrate support to flow a heat transfer fluid beneath the support surface, wherein the flow path comprises a first portion and a second portion, each portion having a substantially equivalent axial length, wherein the first portion is spaced about 2 mm to about 10 mm from the second portion, and wherein the first portion provides a flow of heat transfer fluid in a direction opposite a flow of heat transfer fluid of the second portion.

Abstract translation: 提供了用于控制基板的热均匀性的装置。 可以将基板的热均匀性控制得更均匀，或者基板的热均匀性可以被控制为在所需图案中不均匀。 在一些实施例中，用于控制衬底的热均匀性的装置包括：衬底支撑件，其具有用于在其上支撑衬底的支撑表面; 以及设置在所述基板支撑件内的流动路径，以使传热流体在所述支撑表面下方流动，其中所述流动路径包括第一部分和第二部分，每个部分具有基本相当的轴向长度，其中所述第一部分间隔开约2 从第二部分到约10mm，并且其中第一部分在与第二部分的传热流体的流动相反的方向上提供传热流体的流动。