公开(公告)号：US20150075976A1

公开(公告)日：2015-03-19

申请号：US14553840

申请日：2014-11-25

Applicant: APPLIED Materials, Inc.

Inventor： Randy A. Harris ,  Daniel J. Woodruff ,  Jeffrey I. Turner ,  Gregory J. Wilson ,  Paul R. McHugh

IPC: C25D17/12 ,  C25D17/00

CPC classification number: C25D17/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002

Abstract: An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.

Abstract translation: 电镀处理器包括具有形成在通道中的连续流路的电极板。 流路可以可选地是卷绕的流动路径。 一个或多个电极定位在通道中。 膜板在它们之间附着有电极板。 电解液以高速移动通过流路，防止气泡粘到膜底部。 流动路径中的任何气泡被夹带在快速移动的电解质中并从膜中带走。 电镀处理器可以替代地具有延伸通过形成为线圈或其它形状的管状膜的线电极，任选地包括具有直段的形状。