公开(公告)号：US10474033B2

公开(公告)日：2019-11-12

申请号：US15692087

申请日：2017-08-31

申请人： Applied Materials, Inc.

发明人： Viachslav Babayan ,  Douglas A. Buchberger, Jr. ,  Qiwei Liang ,  Ludovic Godet ,  Srinivas D. Nemani ,  Daniel J. Woodruff ,  Randy Harris ,  Robert B. Moore

IPC分类号： G03D5/00 ,  G03F7/20 ,  H01L21/687 ,  G03F7/16 ,  G03F7/26 ,  G03F7/38

摘要： Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

公开(公告)号：US10047453B2

公开(公告)日：2018-08-14

申请号：US14721693

申请日：2015-05-26

申请人： APPLIED Materials, Inc.

发明人： Daniel J. Woodruff ,  Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： C25D17/18 ,  C25D17/00 ,  C25D21/10

摘要： An electroplating processor includes a base having a vessel body. A membrane assembly including a membrane housing is attached to a membrane plate. A membrane is provided on a membrane support attached to the membrane housing. An anode assembly includes an anode cup and one or more anodes in the anode cup. An anode plate is attached to the anode cup. Two or more posts on a first side of the anode plate are engageable with post fittings on the membrane plate. Latches on a second side of the anode plate are engageable with and releasable from a latch fitting on the membrane plate. The anode assembly is quickly and easily removable from the processor for maintenance, without disturbing or removing other components of the processor.

公开(公告)号：US20140262795A1

公开(公告)日：2014-09-18

申请号：US13829197

申请日：2013-03-14

申请人： APPLIED MATERIALS, INC.

发明人： Nolan L. Zimmerman ,  Randy A. Harris ,  Daniel J. Woodruff

IPC分类号： C25D21/04

CPC分类号： C25D21/04 ,  C25D5/003 ,  C25D17/001 ,  C25D17/06

摘要： A substrate processor uses pressurized gas to create a vortex for lifting and holding a wafer, and to create a vacuum to prevent the wafer from adhering to a contact ring seal after electroplating the wafer. A processor head has a rotor movable into and out of an electrolyte vessel. A backing plate on the rotor includes vortex outlets which create the vortex in the rotor. A vacuum channel adjacent to the perimeter of the rotor applies vacuum to the wafer edges to hold the wafer onto the backing plate. A solenoid or switch in the head has a first position to supply gas flow to the vortex outlets, and a second position to supply gas flow to an aspirator which creates the vacuum in the vacuum channel.

摘要翻译： 基板处理器使用加压气体来产生用于提升和保持晶片的涡流，并且在电镀晶片之后产生真空以防止晶片粘附到接触环密封件。 处理器头具有可移入和移出电解质容器的转子。 转子上的背板包括在转子中产生涡流的涡流出口。 邻近转子周边的真空通道对晶片边缘施加真空以将晶片保持在背板上。 头部中的螺线管或开关具有向涡流出口提供气流的第一位置，以及向吸气器供应气体的第二位置，该吸气器在真空通道中产生真空。

公开(公告)号：US09068272B2

公开(公告)日：2015-06-30

申请号：US13830131

申请日：2013-03-14

申请人： APPLIED Materials, Inc.

发明人： Daniel J. Woodruff

IPC分类号： C25D17/00

CPC分类号： C25D17/001 ,  C25D17/002

摘要： An electroplating processor includes a thin lower membrane support for supporting a membrane. The lower membrane support may be provided as a flexible plastic sheet having a pattern of through-openings. The through-openings may be aligned with openings in a rigid upper membrane support. The perimeter of the lower membrane may be clamped in the same perimeter seal as used to clamp and seal the perimeter of the membrane. The lower membrane support supports the membrane without adding significantly to the overall height of the processor. The processor can be stacked in a two level processing system without requiring additional clean room space.

摘要翻译： 电镀处理器包括用于支撑膜的薄的下膜支撑件。 下膜支撑件可以设置为具有通孔图案的柔性塑料片。 通孔可以与刚性上膜支撑体中的开口对准。 下膜的周边可以夹紧在用于夹紧和密封膜的周边的相同的周边密封中。 下膜支撑件支撑膜，而不显着增加处理器的整体高度。 处理器可以堆叠在两级处理系统中，而不需要额外的洁净室空间。

公开(公告)号：US20140151218A1

公开(公告)日：2014-06-05

申请号：US13830131

申请日：2013-03-14

申请人： APPLIED MATERIALS, INC.

发明人： Daniel J. Woodruff

IPC分类号： C25D17/00

CPC分类号： C25D17/001 ,  C25D17/002

摘要： An electroplating processor includes a thin lower membrane support for supporting a membrane. The lower membrane support may be provided as a flexible plastic sheet having a pattern of through-openings. The through-openings may be aligned with openings in a rigid upper membrane support. The perimeter of the lower membrane may be clamped in the same perimeter seal as used to clamp and seal the perimeter of the membrane. The lower membrane support supports the membrane without adding significantly to the overall height of the processor. The processor can be stacked in a two level processing system without requiring additional clean room space.

摘要翻译： 电镀处理器包括用于支撑膜的薄的下膜支撑件。 下膜支撑件可以设置为具有通孔图案的柔性塑料片。 通孔可以与刚性上膜支撑体中的开口对准。 下膜的周边可以夹紧在用于夹紧和密封膜的周边的相同的周边密封中。 下膜支撑件支撑膜，而不显着增加处理器的整体高度。 处理器可以堆叠在两级处理系统中，而不需要额外的洁净室空间。

公开(公告)号：US10260855B2

公开(公告)日：2019-04-16

申请号：US14066092

申请日：2013-10-29

申请人： APPLIED MATERIALS, INC.

发明人： Todd J. Egan ,  Edward W. Budiarto ,  Robert O. Miller ,  Abraham Ravid ,  Bridger E. Hoerner ,  Robert W. Batz, Jr. ,  Daniel J. Woodruff

IPC分类号： C25D7/12 ,  G01B7/06 ,  C25D17/00 ,  C25D17/12 ,  C25D21/12 ,  G01N27/20

摘要： An electroplating reactor includes an electro-plating solution in a bath, a ring cathode in the bath and located to contact a workpiece such that only the front side of the workpiece is immersed in the solution, plural anodes immersed in the bath below the ring cathode, and plural anode voltage sources coupled to the plural anodes; plural thickness sensors at spatially separate locations on the back side of the workpiece with feedback control to the anode voltage sources.

公开(公告)号：US20170154797A1

公开(公告)日：2017-06-01

申请号：US14989488

申请日：2016-01-06

申请人： Applied Materials, Inc.

发明人： Viachslav Babayan ,  Douglas A. Buchberger, JR. ,  Qiwei Liang ,  Ludovic Godet ,  Srinivas D. Nemani ,  Daniel J. Woodruff ,  Randy Harris ,  Robert B. Moore

IPC分类号： H01L21/67 ,  G03F7/20

CPC分类号： G03F7/2035 ,  G03F7/168 ,  G03F7/26 ,  G03F7/38 ,  H01L21/68764

摘要： Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

公开(公告)号：US20130075265A1

公开(公告)日：2013-03-28

申请号：US13681933

申请日：2012-11-20

申请人： Applied Materials Inc.

发明人： Paul R. McHugh ,  Gregory J. Wilson ,  Daniel J. Woodruff

IPC分类号： C25D7/12 ,  C25F3/30

CPC分类号： C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/10 ,  C25F3/30

摘要： Methods for electrochemically processing microfeature wafers using at least one counter electrode in a vessel, a supplementary electrode and a supplementary virtual electrode. The supplementary electrode is configured to operate independently from the counter electrode in the vessel, and it can be a thief electrode and/or a de-plating electrode depending. The supplementary electrode can further be used as another counter electrode during a portion of a plating cycle or polishing cycle. The supplementary virtual electrode is located in the processing zone, and it is configured to counteract an electric field offset relative to the wafer associated with an offset between the wafer and the counter electrode.

摘要翻译： 使用容器中的至少一个对电极，辅助电极和辅助虚拟电极来电化学处理微片的方法。 辅助电极被配置为独立于容器中的对电极操作，并且其可以是取决于电极的去除电极和/或脱镀电极。 在电镀循环或抛光循环的一部分期间，辅助电极可以进一步用作另一个对电极。 辅助虚拟电极位于处理区域中，并且其被配置为抵消相对于与晶片和对电极之间的偏移相关联的晶片的电场偏移。

公开(公告)号：US11112697B2

公开(公告)日：2021-09-07

申请号：US16272962

申请日：2019-02-11

申请人： Applied Materials, Inc.

发明人： Viachslav Babayan ,  Douglas A. Buchberger, Jr. ,  Qiwei Liang ,  Ludovic Godet ,  Srinivas D. Nemani ,  Daniel J. Woodruff ,  Randy Harris ,  Robert B. Moore

IPC分类号： H01L21/67 ,  H01L21/687 ,  G03F7/20 ,  G03F7/16 ,  G03F7/26 ,  G03F7/38 ,  G03F7/40

摘要： Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

公开(公告)号：US20160348263A1

公开(公告)日：2016-12-01

申请号：US14721693

申请日：2015-05-26

申请人： APPLIED Materials, Inc.

发明人： Daniel J. Woodruff ,  Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： C25D17/00 ,  C25D21/10

CPC分类号： C25D17/001 ,  C25D17/002 ,  C25D17/008 ,  C25D21/10

摘要： An electroplating processor includes a base having a vessel body. A membrane assembly including a membrane housing is attached to a membrane plate. A membrane is provided on a membrane support attached to the membrane housing. An anode assembly includes an anode cup and one or more anodes in the anode cup. An anode plate is attached to the anode cup. Two or more posts on a first side of the anode plate are engageable with post fittings on the membrane plate. Latches on a second side of the anode plate are engageable with and releasable from a latch fitting on the membrane plate. The anode assembly is quickly and easily removable from the processor for maintenance, without disturbing or removing other components of the processor.

摘要翻译： 电镀处理器包括具有容器主体的底座。 包括膜壳体的膜组件附接到膜板。 膜附着在膜壳体上。 阳极组件包括阳极杯和阳极杯中的一个或多个阳极。 阳极板连接到阳极杯。 在阳极板的第一侧上的两个或更多个柱可与膜板上的柱接头接合。 在阳极板的第二侧上的闩锁可以与膜板上的闩锁配件接合并且可从其释放。 阳极组件可快速且容易地从处理器移除以进行维护，而不会干扰或去除处理器的其它部件。