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公开(公告)号:US20230203654A1
公开(公告)日:2023-06-29
申请号:US18147631
申请日:2022-12-28
Applicant: ASM IP Holding, B.V.
Inventor: Paridhi Gupta , Taku Omori , Cheuk Li , Aadil Vora , Todd Dunn
IPC: C23C16/455 , C23C16/52
CPC classification number: C23C16/45544 , C23C16/52 , C23C16/45587
Abstract: Apparatus and method for semiconductor substrate processing are presented. For devices such as valves used for semiconductor substrate processing especially a process like ALD, there is a need to monitor and control the exact time taken from the signal to open and close the valves so that delay times may be controlled. In an embodiment, an apparatus comprising a reactor, a valve, a process controller and a valve monitor system is presented. The process controller may be operationally connected to the valve and may be provided with a memory. The sensors may be either electrical or optical sensors.
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2.
公开(公告)号:US20230341155A1
公开(公告)日:2023-10-26
申请号:US18135792
申请日:2023-04-18
Applicant: ASM IP Holding B.V.
Inventor: Pawan Sharma , Aadil Vora , Ankit Kimtee
CPC classification number: F25B21/02 , F25B41/40 , F25B2321/021 , F25B2321/023 , F25B2700/21
Abstract: A precursor vessel cooling assembly, a reactor system including the assembly, and methods of using the assembly and system are disclosed. The precursor vessel cooling assembly includes a thermoelectric cooling device and a fluid-cooled plate to maintain a desired temperature of a precursor vessel or other portion of the precursor vessel cooling assembly.
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