公开(公告)号：US20230215697A1

公开(公告)日：2023-07-06

申请号：US18092362

申请日：2023-01-02

Applicant: ASM IP Holding B.V.

Inventor： Ping Ren

IPC: H01J37/32

CPC classification number: H01J37/32357 ,  H01J37/32899 ,  H01J37/32862 ,  H01J37/32449 ,  H01J2237/332

Abstract: A substrate processing apparatus is disclosed. Exemplary substrate processing apparatus includes a plurality of reaction chambers; a shared remote plasma unit; a plurality of first cleaning gas lines configured to fluidly couple the shared remote plasma unit to the reaction chambers; and a cleaning gas source to provide the shared remote plasma unit with a cleaning gas; wherein each of the first cleaning gas lines is provided with a valve and is connected to a sidewall of the reaction chamber.

公开(公告)号：US20230338914A1

公开(公告)日：2023-10-26

申请号：US18137800

申请日：2023-04-21

Applicant: ASM IP Holding B.V.

Inventor： Ping Ren

IPC: B01J19/00 ,  B01J19/24

CPC classification number: B01J19/0053 ,  B01J19/247 ,  B01J2219/029

Abstract: A substrate processing apparatus is disclosed. Exemplary substrate processing apparatus includes a reaction chamber provided with a chamber wall; a susceptor disposed within the reaction chamber to support a substrate; a gas supply unit to supply a gas to the substrate; and an exhaust duct disposed within the reaction chamber, comprising: an inner ring comprising a first inner end and a second inner end; wherein the first inner end is configured to contact a bottom of the chamber wall; and an outer ring provided with a plurality of holes, the outer ring comprising a first outer end and a second outer end; wherein the first outer end is configured to contact a side of the chamber wall and the second outer end is configured to be engaged with the second inner end.