公开(公告)号：USD864134S1

公开(公告)日：2019-10-22

申请号：US29667702

申请日：2018-10-24

Applicant: ASM IP Holding B.V.

Designer： Toshiharu Watarai ,  Yozo Ikedo ,  Takuya Suguri

公开(公告)号：US10435789B2

公开(公告)日：2019-10-08

申请号：US15370834

申请日：2016-12-06

Applicant: ASM IP Holding B.V.

Inventor： Naoto Tsuji ,  Takuya Suguri ,  Yozo Ikedo

IPC: H01L21/00 ,  C23C16/00 ,  C23C16/50 ,  H01J37/00 ,  H01L21/683 ,  C23C16/503

Abstract: A substrate treatment apparatus includes a lower electrode, an upper electrode, a first AC power supply that is connected to the upper electrode and supplies AC power at a first frequency, a second AC power supply that is connected to the upper electrode and supplies AC power at a second frequency which is lower than the first frequency, an internal electrode provided in the lower electrode, a filter circuit connected to the internal electrode, and a DC power supply connected to the internal electrode via the filter circuit. The filter circuit includes a first filter circuit that becomes low impedance with respect to AC power at the first frequency compared to AC power at the second frequency, and a second filter circuit that becomes low impedance with respect to AC power at the second frequency compared to AC power at the first frequency.