公开(公告)号：US20140284404A1

公开(公告)日：2014-09-25

申请号：US13847628

申请日：2013-03-20

申请人： ASM TECHNOLOGY SINGAPORE PTE LTD.

发明人： Teng Hock KUAH ,  Hongbo LIU ,  Jiuan WEI ,  Wentao WANG ,  Jingsheng CHEN ,  Jiapei DING ,  Ravindra RAGHAVENDRA ,  Bubesh Babu JOTHEESWARAN ,  Meer Saiful HASSAN

IPC分类号： C23C16/455

CPC分类号： C23C16/45565

摘要： Disclosed is a chemical vapour deposition injector 100, comprising a gas injector body 104 having a plurality of holes for directing a first gas from a first gas plenum into respective first gas channels of the gas injector body, each first gas channel extending in a first direction and arranged to branch into separate flow paths; a plurality of discrete first conduits, each first conduit being arranged to connect to a respective one of the discrete flow paths for carrying the first gas to a reaction chamber; a second gas channel for directing a second gas from a second gas plenum into the gas injector body, the second gas channel having a longitudinal axis which extends in a second direction transverse to the first direction; and a plurality of discrete second conduits coupled to the second gas channel and arranged to carry the second gas from the second gas channel to the reactor chamber; wherein at least some of the discrete second conduits are arranged between the discrete first conduits.

摘要翻译： 公开了一种化学气相沉积喷射器100，其包括气体喷射器主体104，气体喷射器主体104具有多个孔，用于将第一气体从第一气室引导到气体喷射器主体的相应的第一气体通道中，每个第一气体通道沿第一方向 并布置成分支到单独的流动路径; 多个离散的第一管道，每个第一管道被布置成连接到分离的流动路径中的相应一个，用于将第一气体运送到反应室; 第二气体通道，用于将第二气体从第二气体充气室引导到气体喷射器主体中，所述第二气体通道具有沿与第一方向横向的第二方向延伸的纵向轴线; 以及多个离散的第二管道，其联接到所述第二气体通道并被布置成将所述第二气体从所述第二气体通道运送到所述反应室; 其中所述离散的第二导管中的至少一些布置在所述离散的第一导管之间。

公开(公告)号：US20180117813A1

公开(公告)日：2018-05-03

申请号：US15341733

申请日：2016-11-02

申请人： ASM Technology Singapore Pte Ltd

发明人： Shu Chuen HO ,  Teng Hock KUAH ,  Jiapei DING ,  Jian Xiong SU ,  Ravindra RAGHAVENDRA

IPC分类号： B29C45/43 ,  B29C45/14 ,  B29C45/17 ,  B29C45/26 ,  H01L23/29

CPC分类号： B29C45/43 ,  B29C45/14065 ,  B29C45/14336 ,  B29C45/14639 ,  B29C45/1701 ,  B29C45/2602 ,  B29K2105/20 ,  B29K2995/0005 ,  B29L2031/34 ,  H01L21/565 ,  H01L23/293

摘要： The invention provides a molding apparatus comprising a first mold part operative to hold a semiconductor substrate, and a second mold part having a main surface facing the first mold part. The first and second mold parts are movable relative to each other between an open arrangement and a closed arrangement. The main surface comprises portions defining a mold cavity, and a recess at least partially surrounding the mold cavity. The main surface also comprises a compressible structure located within the recess, wherein at least a portion of the compressible structure extends out of the recess towards the first mold part and is compressible into the recess when the compressible structure contacts the semiconductor substrate in the closed arrangement. The second mold part also comprises one or more air conduits operative to introduce compressed air into the mold cavity.