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    FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES
    1.
    发明申请
    FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES 有权

    公开(公告)号：US20220359459A1

    公开(公告)日：2022-11-10

    申请号：US17307028

    申请日：2021-05-04

    申请人： ASM Technology Singapore Pte Ltd

    发明人： Jiapei DING ,  Rolan Ocuaman CAMBA ,  Teng Hock KUAH ,  Jian LIAO ,  Kar Weng YAN

    IPC分类号： H01L23/00 ,  H01L25/07

    摘要： An apparatus having a seal plate which includes rigid hard portions and one or more flexible soft portions located between the hard portions is used for bonding at least one semiconductor device onto a substrate that is supported on a platform. The seal plate is movable between a first position which is spaced from the substrate and a second position whereat a first side of the seal plate is configured to be in contact with the substrate. A diaphragm covers a second side of the seal plate opposite to the first side. A fluid pressure generator exerts a fluid pressure onto the diaphragm to actuate the diaphragm to compress the one or more soft portions to transmit a bonding force onto the at least one semiconductor device during bonding.

    APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE
    2.
    发明申请
    APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20190080939A1

    公开(公告)日：2019-03-14

    申请号：US15701870

    申请日：2017-09-12

    申请人： ASM Technology Singapore Pte Ltd

    发明人： Jiapei DING ,  Kar Weng YAN ,  Teng Hock KUAH ,  Jian LIAO ,  Keng Yew SONG ,  Bin YUAN ,  Deivasigamani MOULEESWARAN

    IPC分类号： H01L21/67 ,  H01L21/56 ,  H01L23/00 ,  H01L21/687 ,  H01L21/68

    摘要： The invention provides an apparatus, for processing a semiconductor device, comprising a first tool which comprises a pressure application component, a guide, and a spacer moveable in the guide. A gap is defined between the spacer and the guide and is operable to allow the spacer to tilt in relation to the guide. The apparatus also comprises a second tool for holding the semiconductor device, wherein the first and second tools are moveable relative to each other between an uncoupled state and a coupled state. The spacer comprises a first portion proximate the pressure application component, wherein in the coupled state, the pressure application component is operable to apply a force as a first pressure to the first portion. The spacer also comprises a second portion distal from the pressure application component, wherein in the coupled state, the second portion is proximate the semiconductor device and is operable to transmit the force from the pressure application component to the semiconductor device as a second pressure.

    CHEMICAL VAPOUR DEPOSITION INJECTOR
    3.
    发明申请
    CHEMICAL VAPOUR DEPOSITION INJECTOR 审中-公开
    化学蒸气沉积注射器

    公开(公告)号：US20140284404A1

    公开(公告)日：2014-09-25

    申请号：US13847628

    申请日：2013-03-20

    申请人： ASM TECHNOLOGY SINGAPORE PTE LTD.

    发明人： Teng Hock KUAH ,  Hongbo LIU ,  Jiuan WEI ,  Wentao WANG ,  Jingsheng CHEN ,  Jiapei DING ,  Ravindra RAGHAVENDRA ,  Bubesh Babu JOTHEESWARAN ,  Meer Saiful HASSAN

    IPC分类号： C23C16/455

    CPC分类号： C23C16/45565

    摘要： Disclosed is a chemical vapour deposition injector 100, comprising a gas injector body 104 having a plurality of holes for directing a first gas from a first gas plenum into respective first gas channels of the gas injector body, each first gas channel extending in a first direction and arranged to branch into separate flow paths; a plurality of discrete first conduits, each first conduit being arranged to connect to a respective one of the discrete flow paths for carrying the first gas to a reaction chamber; a second gas channel for directing a second gas from a second gas plenum into the gas injector body, the second gas channel having a longitudinal axis which extends in a second direction transverse to the first direction; and a plurality of discrete second conduits coupled to the second gas channel and arranged to carry the second gas from the second gas channel to the reactor chamber; wherein at least some of the discrete second conduits are arranged between the discrete first conduits.

    摘要翻译： 公开了一种化学气相沉积喷射器100，其包括气体喷射器主体104，气体喷射器主体104具有多个孔，用于将第一气体从第一气室引导到气体喷射器主体的相应的第一气体通道中，每个第一气体通道沿第一方向 并布置成分支到单独的流动路径; 多个离散的第一管道，每个第一管道被布置成连接到分离的流动路径中的相应一个，用于将第一气体运送到反应室; 第二气体通道，用于将第二气体从第二气体充气室引导到气体喷射器主体中，所述第二气体通道具有沿与第一方向横向的第二方向延伸的纵向轴线; 以及多个离散的第二管道，其联接到所述第二气体通道并被布置成将所述第二气体从所述第二气体通道运送到所述反应室; 其中所述离散的第二导管中的至少一些布置在所述离散的第一导管之间。