公开(公告)号：US20220214622A1

公开(公告)日：2022-07-07

申请号：US17605601

申请日：2020-04-14

申请人： ASML HOLDING N.V. ,  ASML NETHERLANDS B.V.

发明人： Janardan NATH ,  Kalyan Kumar MANKALA ,  Todd R. DOWNEY ,  Joseph Harry LYONS ,  Ozer UNLUHISARCIKLI ,  Alexander Harris LEDBETTER ,  Nicholas Stephen APONE ,  Tian GANG

IPC分类号： G03F7/20

摘要： An illumination adjustment apparatus, to adjust a cross slot illumination of a beam in a lithographic apparatus, includes a plurality of fingers to adjust the cross slot illumination to conform to a selected intensity profile. Each finger has a distal edge that includes at least two segments. The two segments form an indentation of the distal edge.

公开(公告)号：US20240353756A1

公开(公告)日：2024-10-24

申请号：US18682789

申请日：2022-07-27

申请人： ASML Netherlands B.V.

发明人： Todd R. DOWNEY ,  Marianna MANCA ,  Widianta GOMULYA ,  Kalyan Kumar MANKALA ,  Janardan NATH

IPC分类号： G03F7/20

CPC分类号： G03F7/2004

摘要： Systems, apparatuses, and methods are provided for adjusting illumination slit uniformity in a lithographic apparatus. An example method can include determining whether an exposure field for a wafer exposure operation is less than a maximum exposure field of a uniformity correction system. In response to determining that the exposure field is less than the maximum exposure field, the example method can include modifying illumination slit uniformity calibration data associated with the maximum exposure field to generate modified illumination slit uniformity calibration data associated with the exposure field. Subsequently, the example method can include determining an optimal position of a finger assembly of the uniformity correction system based on the modified illumination slit uniformity calibration data.

公开(公告)号：US20240319608A1

公开(公告)日：2024-09-26

申请号：US18262467

申请日：2022-01-16

申请人： ASML Holding N.V.

发明人： Roberto B. WIENER ,  Kalyan Kumar MANKALA ,  Todd R. DOWNEY

IPC分类号： G03F7/00

CPC分类号： G03F7/70141 ,  G03F7/70075 ,  G03F7/70133 ,  G03F7/7015 ,  G03F7/70191 ,  G03F7/7085

摘要： Systems, apparatuses, and methods are provided for adjusting illumination slit uniformity in a lithographic apparatus. An example method can include irradiating, by a radiation source, a portion of a finger assembly with radiation. The example method can further include receiving, by a radiation detector, at least a portion of the radiation in response to the irradiating of the portion of the finger assembly. The example method can further include determining, by a processor, a change in a shape of the finger assembly based on the received radiation. The example method can further include generating, by the processor, a control signal configured to modify a position of the finger assembly based on the determined change in the shape of the finger assembly. Subsequently, the example method can include transmitting, by the processor, the control signal to a motion control system coupled to the finger assembly.