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公开(公告)号:US20220390832A1
公开(公告)日:2022-12-08
申请号:US17776728
申请日:2020-11-18
摘要: A method for source mask optimization or mask only optimization used to image a pattern onto a substrate. The method includes determining a non-uniform illumination intensity profile for illumination; and determining one or more adjustments for the pattern based on the non-uniform illumination intensity profile until a determination that features patterned onto a substrate substantially match a target design. The non-uniform illumination intensity profile may be determined based on an illumination optical system and projection optics of a lithographic apparatus. In some embodiments, the lithographic apparatus includes a slit, and the non-uniform illumination profile is a through slit non-uniform illumination intensity profile. Determining the one or more adjustments for the pattern may include performing optical proximity correction, for example.
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公开(公告)号:US20230035511A1
公开(公告)日:2023-02-02
申请号:US17791641
申请日:2021-01-04
发明人: Ronny DER KINDEREN , Tian GANG , Todd R. DOWNEY
IPC分类号: G03F7/20
摘要: A system, method, a lithographic apparatus and a software product configured to determine a drift in an attribute of an illumination and a corresponding drift correction. The system includes a lithographic apparatus that includes at least two sensors, each configured to measure a property related to an illumination region provided for imaging a substrate. Furthermore, a processor is configured to: determine, based on a ratio of the measured property, a drift of the illumination region with respect to a reference position; determine, based on the drift of the illumination region, a drift in an attribute related to the illumination upstream of the illumination region measured by the at least two sensors, and determine, based on the drift in the attribute, the drift correction to be applied to the attribute to compensate for the drift in the attribute.
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公开(公告)号:US20240353756A1
公开(公告)日:2024-10-24
申请号:US18682789
申请日:2022-07-27
IPC分类号: G03F7/20
CPC分类号: G03F7/2004
摘要: Systems, apparatuses, and methods are provided for adjusting illumination slit uniformity in a lithographic apparatus. An example method can include determining whether an exposure field for a wafer exposure operation is less than a maximum exposure field of a uniformity correction system. In response to determining that the exposure field is less than the maximum exposure field, the example method can include modifying illumination slit uniformity calibration data associated with the maximum exposure field to generate modified illumination slit uniformity calibration data associated with the exposure field. Subsequently, the example method can include determining an optimal position of a finger assembly of the uniformity correction system based on the modified illumination slit uniformity calibration data.
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公开(公告)号:US20220214622A1
公开(公告)日:2022-07-07
申请号:US17605601
申请日:2020-04-14
发明人: Janardan NATH , Kalyan Kumar MANKALA , Todd R. DOWNEY , Joseph Harry LYONS , Ozer UNLUHISARCIKLI , Alexander Harris LEDBETTER , Nicholas Stephen APONE , Tian GANG
IPC分类号: G03F7/20
摘要: An illumination adjustment apparatus, to adjust a cross slot illumination of a beam in a lithographic apparatus, includes a plurality of fingers to adjust the cross slot illumination to conform to a selected intensity profile. Each finger has a distal edge that includes at least two segments. The two segments form an indentation of the distal edge.
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