Alignment Target Contrast in a Lithographic Double Patterning Process
    2.
    发明申请
    Alignment Target Contrast in a Lithographic Double Patterning Process 有权
    光刻双重图案化过程中的对准目标对比度

    公开(公告)号:US20140192333A1

    公开(公告)日:2014-07-10

    申请号:US14202835

    申请日:2014-03-10

    Abstract: A system and method of manufacturing a semiconductor device lithographically and an article of manufacture involving a lithographic double patterning process having a dye added to either the first or second lithographic pattern are provided. The dye is used to detect the location of the first lithographic pattern and to directly align the second lithographic pattern to it. The dye may be fluorescent, luminescent, absorbent, or reflective at a specified wavelength or a given wavelength band. The wavelength may correspond to the wavelength of an alignment beam. The dye allows for detection of the first lithographic pattern even when it is over coated with a radiation sensitive-layer (e.g., resist).

    Abstract translation: 提供光刻制造半导体器件的系统和方法以及涉及具有添加到第一或第二光刻图案上的染料的光刻双重图案化工艺的制品。 该染料用于检测第一光刻图案的位置,并将第二光刻图案直接对准。 染料可以是在指定波长或给定波长带处的荧光,发光,吸收或反射。 波长可对应于对准光束的波长。 染料允许检测第一光刻图案,即使当其涂覆有辐射敏感层(例如抗蚀剂)时。

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