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公开(公告)号:US20250028298A1
公开(公告)日:2025-01-23
申请号:US18713127
申请日:2022-11-30
Applicant: ASML NETHERLANDS B.V.
Inventor: Duan-Fu Stephen HSU , Gerui LIU , Wenjie JIN , Dezheng SUN
IPC: G05B19/4093
Abstract: Dynamic aberration control in a semiconductor manufacturing process is described. In some embodiments, wavefront data representing a wavefront provided by an optical projection system of a semiconductor processing apparatus may be received. Wavefront drift may be determined based on a comparison of the wavefront data and target wavefront data. Based on the wavefront drift, one or more process parameters may be determined. The one or more process parameters include parameters associated with a thermal device, where the thermal device is configured to provide thermal energy to the optical projection system during operation.
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公开(公告)号:US20230205096A1
公开(公告)日:2023-06-29
申请号:US17927866
申请日:2021-05-14
Applicant: ASML NETHERLANDS B.V.
Inventor: Xingyue PENG , Zhan SHI , Duan-Fu Stephen HSU , Rafael C. HOWELL , Gerui LIU
IPC: G03F7/20
CPC classification number: G03F7/705 , G03F7/706 , G03F7/70525
Abstract: Scanner aberration impact modeling in a semiconductor manufacturing process, which may facilitate co-optimization of multiple scanners. Scanner aberration impact modeling may include executing a calibrated model and controlling a scanner based on output from the model. The model is configured to receive patterning system aberration data. The model is calibrated with patterning system aberration calibration data and corresponding patterning process impact calibration data. New patterning process impact data may be determined, based on the model, for the received patterning system aberration data. The model includes a hyperdimensional function configured to correlate the received patterning system aberration data with the new patterning process impact data. The hyperdimensional function is configured to correlate the received patterning system aberration data with the new patterning process impact data in an approximation form, in lieu of a full simulation, without involving calculation of an aerial image or a representation thereof.
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