公开(公告)号：US20190072496A1

公开(公告)日：2019-03-07

申请号：US16114629

申请日：2018-08-28

Applicant: ASML Netherlands B.V.

Inventor： Ioana Sorina Barbu ,  Murat Bozkurt ,  Maurits Van Der Schaar ,  Alberto Da Costa Assafrao

IPC: G01N21/88 ,  G01N21/956 ,  G03F7/20 ,  G01N21/47

Abstract: Multilayered product structures are formed on substrates by a combination of patterning steps, physical processing steps and chemical processing steps. An inspection apparatus illuminates a plurality of target structures and captures pupil images representing the angular distribution of radiation scattered by each target structure. The target structures have the same design but are formed at different locations on a substrate and/or on different substrates. Based on a comparison of the images the inspection apparatus infers the presence of process-induced stack variations between the different locations. In one application, the inspection apparatus separately measures overlay performance of the manufacturing process based on dark-field images, combined with previously determined calibration information. The calibration is adjusted for each target, depending on the stack variations inferred from the pupil images.

公开(公告)号：US11698346B2

公开(公告)日：2023-07-11

申请号：US16114629

申请日：2018-08-28

Applicant: ASML NETHERLANDS B.V.

Inventor： Ioana Sorina Barbu ,  Murat Bozkurt ,  Maurits Van Der Schaar ,  Alberto Da Costa Assafrao

IPC: G01N21/88 ,  G03F7/20 ,  G01N21/95 ,  G01N21/47 ,  G01N21/956 ,  H01L21/66 ,  G03F7/00

CPC classification number: G01N21/8806 ,  G01N21/4788 ,  G01N21/9501 ,  G01N21/95607 ,  G03F7/705 ,  G03F7/7065 ,  G03F7/70525 ,  G03F7/70616 ,  G03F7/70633 ,  H01L22/12

Abstract: Multilayered product structures are formed on substrates by a combination of patterning steps, physical processing steps and chemical processing steps. An inspection apparatus illuminates a plurality of target structures and captures pupil images representing the angular distribution of radiation scattered by each target structure. The target structures have the same design but are formed at different locations on a substrate and/or on different substrates. Based on a comparison of the images the inspection apparatus infers the presence of process-induced stack variations between the different locations. In one application, the inspection apparatus separately measures overlay performance of the manufacturing process based on dark-field images, combined with previously determined calibration information. The calibration is adjusted for each target, depending on the stack variations inferred from the pupil images.