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公开(公告)号:US10725372B2
公开(公告)日:2020-07-28
申请号:US15546583
申请日:2016-01-20
Applicant: ASML Netherlands B.V.
Inventor: Wim Tjibbo Tel , Marinus Jochemsen , Frank Staals , Christopher Prentice , Laurent Michel Marcel Depre , Johannes Marcus Maria Beltman , Roy Werkman , Jochem Sebastiaan Wildenberg , Everhardus Cornelis Mos
IPC: G06F17/50 , G03F1/70 , G03F1/36 , G03F1/22 , G06T7/00 , G06F30/398 , G06F119/18 , G06F30/20 , G06F30/367
Abstract: A method includes determining topographic information of a substrate for use in a lithographic imaging system, determining or estimating, based on the topographic information, imaging error information for a plurality of points in an image field of the lithographic imaging system, adapting a design for a patterning device based on the imaging error information. In an embodiment, a plurality of locations for metrology targets is optimized based on imaging error information for a plurality of points in an image field of a lithographic imaging system, wherein the optimizing involves minimizing a cost function that describes the imaging error information. In an embodiment, locations are weighted based on differences in imaging requirements across the image field.
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公开(公告)号:US10078273B2
公开(公告)日:2018-09-18
申请号:US15121340
申请日:2014-12-17
Applicant: ASML Netherlands B.V.
Inventor: Emil Peter Schmitt-Weaver , Wolfgang Henke , Christopher Prentice , Frank Staals , Wim Tjibbo Tel
CPC classification number: G03F7/70641 , G03F7/70725 , G03F9/7019 , G03F9/7026 , G03F9/7092
Abstract: A lithographic apparatus applies a pattern onto a substrate using an optical projection system. The apparatus includes an optical level sensor and an associated processor for obtaining a height map of the substrate surface prior to applying the pattern. A controller uses the height map to control focusing with respect to the projection system when applying the pattern. The processor is further arranged to use information relating to processing previously applied to the substrate to define at least first and second regions of the substrate and to vary the manner in which the measurement signals are used to control the focusing, between the first and second regions. For example, an algorithm to calculate height values from optical measurement signals can be varied according to differences in known structure and/or materials. Measurements from certain regions can be selectively excluded from calculation of the height map and/or from use in the focusing.
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