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1.发明授权公开(公告)号：US11385550B2
公开(公告)日：2022-07-12
申请号：US16864456
申请日：2020-05-01
发明人： Alexander Ypma , Jasper Menger , David Deckers , David Han , Adrianus Cornelis Matheus Koopman , Irina Lyulina , Scott Anderson Middlebrooks , Richard Johannes Franciscus Van Haren , Jochem Sebastiaan Wildenberg
摘要： In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
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公开(公告)号：US11327406B2
公开(公告)日：2022-05-10
申请号：US17055215
申请日：2019-04-02
IPC分类号： G03F7/20
摘要： A method for estimating a parameter across a region on a substrate, the region being divided into a plurality of sub-regions, the method including: obtaining values of the parameter for at least two sub-regions out of the plurality of sub-regions; and estimating the parameter for a position on the region by evaluation of a function having said values of the parameter as input values, wherein the function: a) has piecewise defined base functions, wherein a single base function is defined across a sub-region; and b) is continuous between one or more adjacent sub-regions of the at least two sub-regions within the region.
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公开(公告)号：US09811006B2
公开(公告)日：2017-11-07
申请号：US15111763
申请日：2014-11-04
CPC分类号： G03F7/70775 , G01B11/272 , G03F7/70625 , G03F7/70633 , G03F7/70683 , G03F9/7003 , G03F9/7046
摘要： A method of determining a measurement subset of metrology point locations which includes a subset of potential metrology point locations on a substrate. The method including identifying a plurality of candidate metrology point locations from the potential metrology point locations. A change in the level of informativity imparted by the measurement subset of metrology point locations which is attributable to the inclusion of that candidate metrology point location into the measurement subset of metrology point locations is evaluated for each of the candidate metrology point locations. The candidate metrology point locations which have the greatest increase in the level of informativity attributed thereto are selected for inclusion into the measurement subset of metrology point locations.
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公开(公告)号：US20210389684A1
公开(公告)日：2021-12-16
申请号：US17411107
申请日：2021-08-25
发明人： Jochem Sebastiaan Wildenberg , Marinus Jochemsen , Erik Jensen , Erik Johannes Maria Wallerbos , Cornelis Johannes Rijnierse , Bijoy Rajasekharan , Roy Werkman , Jurgen Johannes Henderikus Maria Schoonus
IPC分类号： G03F7/20
摘要： A method for optimizing a sequence of processes for manufacturing of product units, includes: associating measurement results of performance parameters (e.g., fingerprints) with the recorded process characteristics (e.g., context); obtaining a characteristic (e.g., context) of a previous process (e.g. deposition) in the sequence already performed on a product unit; obtaining a characteristic (e.g., context) of a subsequent process (e.g., exposure) in the sequence to be performed on the product unit; determining a predicted performance parameter (e.g., fingerprint) of the product unit associated with the sequence of previous and subsequent processes by using the obtained characteristics to retrieve measurement results of the performance parameters (e.g., fingerprints) corresponding to the recorded characteristics; and determining corrections to be applied to future processes (e.g. exposure, etch) in the sequence to be performed on the product unit, based on the determined predicted performance parameter.
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公开(公告)号：US10816904B2
公开(公告)日：2020-10-27
申请号：US16461044
申请日：2018-05-23
发明人： Davit Harutyunyan , Fei Jia , Frank Staals , Fuming Wang , Hugo Thomas Looijestijn , Cornelis Johannes Rijnierse , Maxim Pisarenco , Roy Werkman , Thomas Theeuwes , Tom Van Hemert , Vahid Bastani , Jochem Sebastiaan Wildenberg , Everhardus Cornelis Mos , Erik Johannes Maria Wallerbos
摘要： A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method including: obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.
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公开(公告)号：US10809631B2
公开(公告)日：2020-10-20
申请号：US15951343
申请日：2018-04-12
发明人： Everhardus Cornelis Mos , Jochem Sebastiaan Wildenberg , Marcel Hendrikus Maria Beems , Erik Johannes Maria Wallerbos
IPC分类号： G03F7/20
摘要： A method of monitoring a device manufacturing process, the method including; obtaining an estimated time variation of a process parameter; determining, on the basis of the estimated time variation, a sampling plan for measurements to be performed on a plurality of substrates to obtain information about the process parameter; measuring substrates in accordance with the sampling plan to obtain a plurality of measurements; and determining an actual time variation of the process parameter on the basis of the measurements.
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7.发明授权公开(公告)号：US10274834B2
公开(公告)日：2019-04-30
申请号：US15915674
申请日：2018-03-08
发明人： Alexander Ypma , Jasper Menger , David Deckers , David Han , Adrianus Cornelis Matheus Koopman , Irina Lyulina , Scott Anderson Middlebrooks , Richard Johannes Franciscus Van Haren , Jochem Sebastiaan Wildenberg
摘要： In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
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公开(公告)号：US11669017B2
公开(公告)日：2023-06-06
申请号：US16762982
申请日：2018-11-09
发明人： Roy Werkman , Bijoy Rajasekharan , Lydia Marianna Vergaij-Huizer , Jochem Sebastiaan Wildenberg , Ronald Van Ittersum , Pieter Gerardus Jacobus Smorenberg , Robertus Wilhelmus Van Der Heijden , Xiuhong Wei , Hadi Yagubizade
IPC分类号： G03F7/20
CPC分类号： G03F7/70458 , G03F7/70616
摘要： A method for determining a plurality of corrections for control of at least one manufacturing apparatus used in a manufacturing process for providing product structures to a substrate in a plurality of layers, the method including: determining the plurality of corrections including a correction for each layer, based on an actuation potential of the applicable manufacturing apparatus used in the formation of each layer, wherein the determining includes determining corrections for each layer simultaneously in terms of a matching parameter.
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公开(公告)号：US11442367B2
公开(公告)日：2022-09-13
申请号：US17411107
申请日：2021-08-25
发明人： Jochem Sebastiaan Wildenberg , Marinus Jochemsen , Erik Jensen , Erik Johannes Maria Wallerbos , Cornelis Johannes Rijnierse , Bijoy Rajasekharan , Roy Werkman , Jurgen Johannes Henderikus Maria Schoonus
IPC分类号： G03F7/20
摘要： A method for optimizing a sequence of processes for manufacturing of product units, includes: associating measurement results of performance parameters (e.g., fingerprints) with the recorded process characteristics (e.g., context); obtaining a characteristic (e.g., context) of a previous process (e.g. deposition) in the sequence already performed on a product unit; obtaining a characteristic (e.g., context) of a subsequent process (e.g., exposure) in the sequence to be performed on the product unit; determining a predicted performance parameter (e.g., fingerprint) of the product unit associated with the sequence of previous and subsequent processes by using the obtained characteristics to retrieve measurement results of the performance parameters (e.g., fingerprints) corresponding to the recorded characteristics; and determining corrections to be applied to future processes (e.g. exposure, etch) in the sequence to be performed on the product unit, based on the determined predicted performance parameter.
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公开(公告)号：US11300887B2
公开(公告)日：2022-04-12
申请号：US16463057
申请日：2017-11-06
发明人： Richard Johannes Franciscus Van Haren , Victor Emanuel Calado , Leon Paul Van Dijk , Roy Werkman , Everhardus Cornelis Mos , Jochem Sebastiaan Wildenberg , Marinus Jochemsen , Bijoy Rajasekharan , Erik Jensen , Adam Jan Urbanczyk
IPC分类号： G03F7/20
摘要： A method to change an etch parameter of a substrate etching process, the method including: making a first measurement of a first metric associated with a structure on a substrate before being etched; making a second measurement of a second metric associated with a structure on a substrate after being etched; and changing the etch parameter based on a difference between the first measurement and the second measurement.
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