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公开(公告)号:US11681233B2
公开(公告)日:2023-06-20
申请号:US17282029
申请日:2019-09-26
发明人: Joost De Hoogh , Alain Louis Claude Leroux , Alexander Marinus Arnoldus Huijberts , Christiaan Louis Valentin , Robert Coenraad Wit , Dries Vaast Paul Hemschoote , Frits Van Der Meulen , Johannes Franciscus Martinus Van Santvoort , Radu Donose
CPC分类号: G03F7/70875 , F25D3/10
摘要: A system having a sub-system that is configured to change a thermal condition of a physical component from a set-point to a new set-point, wherein the sub-system includes: a mixer operative to receive a first conditioning fluid having a first temperature and a second conditioning fluid having a second temperature different from the first temperature, and operative to supply to the physical component a mix of the first conditioning fluid and the second conditioning fluid; and a controller configured to control the mixer in dependence on the new set-point. Also a method of operating a lithographic apparatus as well as a device manufactured using the system described herein or according to methods described herein.
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公开(公告)号:US10747127B2
公开(公告)日:2020-08-18
申请号:US16326948
申请日:2017-08-11
发明人: Frits Van Der Meulen , Erik Johan Arlemark , Hendrikus Herman Marie Cox , Martinus Agnes Willem Cuijpers , Joost De Hoogh , Gosse Charles De Vries , Paul Comé Henri De Wit , Sander Catharina Reinier Derks , Ronald Cornelis Gerardus Gijzen , Dries Vaast Paul Hemschoote , Christiaan Alexander Hoogendam , Adrianus Hendrik Koevoets , Raymond Wilhelmus Louis Lafarre , Alain Louis Claude Leroux , Patrick Willem Paul Limpens , Jim Vincent Overkamp , Christiaan Louis Valentin , Koos Van Berkel , Stan Henricus Van Der Meulen , Jacobus Cornelis Gerardus Van Der Sanden , Harmen Klaas Van Der Schoot , David Ferdinand Vles , Evert Auke Rinze Westerhuis
IPC分类号: G03F7/20
摘要: A lithographic apparatus comprising a projection system configured to project a patterned radiation beam to form an exposure area on a substrate held on a substrate table, the lithographic apparatus further comprising a cooling apparatus for cooling the substrate, wherein the cooling apparatus comprises a cooling element located above the substrate table and adjacent to the exposure area, the cooling element being configured to remove heat from the substrate.
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