公开(公告)号：US20240264537A1

公开(公告)日：2024-08-08

申请号：US18682692

申请日：2022-07-05

Applicant: ASML Netherlands B.V.

Inventor： Gijs TEN HAAF ,  Niels HAVIK ,  Joost ROOZE ,  Vu Quang TRAN

IPC: G03F7/00 ,  G03F9/00 ,  G06F30/398

CPC classification number: G03F7/705 ,  G03F7/70508 ,  G03F7/70633 ,  G03F7/706837 ,  G03F7/706839 ,  G03F9/7046 ,  G06F30/398

Abstract: Disclosed is a method for modeling alignment data over a substrate area relating to a substrate being exposed in a lithographic process. The method comprises obtaining alignment data relating to said substrate and separating the alignment data into systematic component which is relatively stable between different substrates and a non-systematic component which is not relatively stable between different substrates. The systematic component and the non-systematic component are individually modeled and a process correction for the substrate determined based on the modeled systematic component and modeled non-systematic component.