公开(公告)号：US20230236518A1

公开(公告)日：2023-07-27

申请号：US18008283

申请日：2021-06-09

申请人： ASML Netherlands B.V. ,  ASML HOLDING N.V.

发明人： Bastiaan Lambertus Wilhelmus Marinus VAN DE VEN ,  Koos VAN BERKEL ,  Marcus Adrianus VAN DE KERKHOF ,  Roger Franciscus Mattheus Maria HAMELINCK ,  Shahab SHERVIN ,  Marinus Augustinus Christiaan VERSCHUREN ,  Johannes Bernardus Charles ENGELEN ,  Matthias KRUIZINGA ,  Tammo UITTERDIJK ,  Oleksiy Sergiyovich GALAKTIONOV ,  Kjeld Gertrudus Hendrikus JANSSEN ,  Johannes Adrianus Cornelis Maria PIJNENBURG ,  Peter VAN DELFT

IPC分类号： G03F7/00

CPC分类号： G03F7/70825 ,  G03F7/70708

摘要： An object holder configured to support an object, the object holder comprising: a core body comprising a plurality of burls having distal ends in a support plane for supporting the object; an electrostatic sheet between the burls, the electrostatic sheet comprising an electrode sandwiched between dielectric layers; and a circumferential barrier for reducing outflow of gas escaping from space between the object and the core body.

公开(公告)号：US20240248415A1

公开(公告)日：2024-07-25

申请号：US18562770

申请日：2022-04-28

申请人： ASML Holding N.V. ,  ASML Netherlands B.V.

发明人： Shahab SHERVIN ,  Tammo UITTERDIJK ,  Matthew LIPSON ,  Marcus Martinus Petrus Adrianus VERMEULEN

IPC分类号： G03F7/00 ,  H01L21/687

CPC分类号： G03F7/707 ,  G03F7/7095 ,  G03F7/70975 ,  H01L21/6875

摘要： The present disclosure is directed to a modular wafer table and methods for refurbishing a scrapped wafer to manufacture the modular wafer table. The method comprises removing one or more burls from a surface of a wafer table; polishing the surface of the wafer table after removing the one or more burls to form a core module; forming a burl module having a plurality of burls thereon; and bonding the core module to the burl module.