Abstract:
A device for cooling at least two distinct heat sources comprises a closed circuit in which a diphasic fluid flows. At least one capillary evaporator is configured to be placed in thermo contact with one of the heat sources, referred to as the primary heat source. Each other heat source referred to as a secondary heat source that is to be cooled. At least one exchanger configured to be placed in thermal contact with the secondary heat source. At least one first condenser positioned downstream of the evaporator, and upstream of the at least one exchanger. At least one last condenser positioned upstream of the evaporator and downstream of the at least one exchanger.
Abstract:
A device for cooling at least two distinct heat sources comprises a closed circuit in which a diphasic fluid flows. At least one capillary evaporator is configured to be placed in thermo contact with one of the heat sources, referred to as the primary heat source. Each other heat source referred to as a secondary heat source that is to be cooled. At least one exchanger configured to be placed in thermal contact with the secondary heat source. At least one first condenser positioned downstream of the evaporator, and upstream of the at least one exchanger. At least one last condenser positioned upstream of the evaporator and downstream of the at least one exchanger.
Abstract:
A cooling device for regulating the temperature of a heat source of a satellite. The cooling device comprises at least one fluid loop is formed by an evaporator comprising a tank, at least one condenser, two conduits connecting the evaporator to the condenser, a heat transfer fluid flowing inside the fluid loop. The cooling device further comprises a device for pressurizing the fluid loop or a thermal damper. The thermal damper comprises a variable volume leak-tight chamber having a volume which varies on the basis of the operating temperature of the fluid loop so as to provide a substantially constant temperature inside the fluid loop.