公开(公告)号：US09313915B2

公开(公告)日：2016-04-12

申请号：US14072758

申请日：2013-11-05

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chia-Ching Niu ,  Ing-Jer Chiou ,  Cheng-Yu Wang

IPC: H02B1/00 ,  H02B1/56 ,  H05K7/20 ,  H05K1/00 ,  H01R13/46 ,  H05K5/00 ,  H01L23/34 ,  F28F7/00 ,  F28D15/00 ,  G06F1/20 ,  F28D15/02 ,  F04D29/40

CPC classification number: H05K7/20 ,  F04D29/40 ,  F28D15/02 ,  G06F1/20 ,  G06F1/203 ,  H05K7/20145 ,  H05K7/20445

Abstract: An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the upper cover and the lower cover. The heat conducting pillar is disposed in the accommodating space and physically connected with the upper cover and the lower cover to balance the temperature of the upper cover and the lower cover.

Abstract translation: 电子装置包括上盖，与上盖结合的下盖和导热支柱。 由上盖和下盖形成容纳空间。 导热柱设置在容纳空间中并与上盖和下盖物理连接，以平衡上盖和下盖的温度。

公开(公告)号：US10185377B2

公开(公告)日：2019-01-22

申请号：US14981946

申请日：2015-12-29

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chia-Ching Niu ,  Ing-Jer Chiou ,  Cheng-Yu Wang

IPC: G06F1/20 ,  G01K1/14 ,  G05B15/02

Abstract: A heat dissipation method applied to an electronic device including an electronic component is provided. The heat dissipation method includes: sensing a temperature of an electronic component by the temperature sensor; determining whether the temperature of the electronic component is larger than a threshold temperature; determining a rotation speed rank corresponding to a basic rotation speed and intermittently accelerating the basic rotation speed in the rotation speed rank while the sensed temperature of the electronic device is larger than a threshold temperature.

公开(公告)号：US20160202740A1

公开(公告)日：2016-07-14

申请号：US14981946

申请日：2015-12-29

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chia-Ching Niu ,  Ing-jer Chiou ,  Cheng-Yu Wang

IPC: G06F1/20 ,  G05B15/02 ,  G01K1/14

CPC classification number: G06F1/206 ,  G01K1/14 ,  G05B15/02

Abstract: A heat dissipation method applied to an electronic device including, an electronic component is provided. The heat dissipation method includes sensing a temperature of an electronic component by the temperature sensor; determining whether the temperature of the electronic component is larger than a threshold temperature; determining a rotation speed rank corresponding to a basic rotation speed and intermittently accelerating the basic rotation speed in the rotation speed rank while the sensed temperature of the electronic device is larger than a threshold temperature.

Abstract translation: 提供了一种应用于包括电子部件的电子设备的散热方法。 散热方法包括通过温度传感器感测电子部件的温度; 确定电子部件的温度是否大于阈值温度; 确定与基本旋转速度相对应的转速等级，并且在电子设备的感测温度大于阈值温度的同时间歇地加速旋转速度等级中的基本旋转速度。