公开(公告)号：US11574496B2

公开(公告)日：2023-02-07

申请号：US17513886

申请日：2021-10-29

Applicant: Au Optronics Corporation

Inventor： Shang-Wei Hsieh ,  Ken-Yu Liu ,  Chao-Chien Chiu ,  Yan-Liang Chen

IPC: G06V40/13 ,  G02F1/13357 ,  G02F1/1335 ,  G06V40/12

Abstract: A fingerprint recognition device including a light emitting layer, an image sensing layer and a micro-lens layer is provided. The image sensing layer has a plurality of pixels. The micro-lens layer is disposed between the light emitting layer and the image sensing layer and has a plurality of micro lenses respectively corresponding to the pixels. A distance between the micro-lens layer and the light emitting layer is less than or equal to 800 um and greater than or equal to h1, where h1=(x/2×tan θ), x is the minimum distance between two micro lenses respectively corresponding to different pixels on a plane where the micro-lens layer is disposed, and θ is an FWHM light receiving angle of each of the micro lenses.

公开(公告)号：US11308307B2

公开(公告)日：2022-04-19

申请号：US17359630

申请日：2021-06-27

Applicant: Au Optronics Corporation

Inventor： Yu-Han Huang ,  Chao-Chien Chiu ,  Shih-Hua Lu

IPC: G06K9/00

Abstract: A fingerprint sensing module including a substrate, a plurality of photosensitive devices, a collimation structure layer, a light-shielding layer, an interposer and a plurality of micro lenses is provided. The photosensitive devices are disposed on the substrate. The collimation structure layer is disposed on the photosensitive devices. The light-shielding layer is disposed on the collimation structure layer and has a surface and a plurality of first openings recessed from the surface. The first openings respectively overlap the photosensitive devices. The interposer is disposed on the collimation structure layer and positioned in a part of the first openings of the light-shielding layer. The micro lenses are disposed on the interposer and respectively overlap the first openings.

公开(公告)号：US20200274004A1

公开(公告)日：2020-08-27

申请号：US16538833

申请日：2019-08-13

Applicant: Au Optronics Corporation

Inventor： Po-Chao Chang ,  Ruei-Pei Chen ,  Chao-Chien Chiu

IPC: H01L31/0216 ,  H01L31/0224 ,  H01L31/02 ,  H01L27/146

Abstract: A photosensor includes a substrate, a sensing device, and a light shielding layer. The sensing device is disposed on the substrate and includes a first electrode, a photo-sensing layer, and a second electrode. The first electrode is disposed on the substrate. The photo-sensing layer is disposed on the first electrode. The second electrode is disposed on the photo-sensing layer, and the photo-sensing layer is interposed between the first electrode and the second electrode. The light shielding layer is disposed on the second electrode. Here, the photo-sensing layer has a shielded portion shielded by the light shielding layer and a photo-receiving portion not shielded by the light shielding layer, and an area of the shielded portion is 55% to 99% of an entire area of the photo-sensing layer.

公开(公告)号：US10718985B2

公开(公告)日：2020-07-21

申请号：US16194394

申请日：2018-11-19

Applicant: Au Optronics Corporation

Inventor： Ching-Shun Lin ,  Chao-Chien Chiu

IPC: G02F1/1362 ,  G02F1/1368 ,  H01L29/66 ,  H01L27/12 ,  H01L29/786

Abstract: A pixel array substrate including pixel units is provided. Each of the pixel units includes a thin film transistor, a first insulating layer disposed on the thin film transistor, a common electrode disposed on the first insulating layer, a second insulating layer covering the common electrode, and a pixel electrode disposed on the second insulating layer. The first insulating layer includes a first via. The common electrode includes an opening and connects to the first via. The second insulating layer includes a second via and connects to the opening and the first via. The pixel electrode connects to the thin film transistor through the second via, the opening and the first via. The first via has two first sides opposite to each other and the opening has two third sides opposite to each other are aligned. A fourth side of the opening is not connected to the first via and the second via.

公开(公告)号：US11781905B2

公开(公告)日：2023-10-10

申请号：US17711070

申请日：2022-04-01

Applicant: Au Optronics Corporation

Inventor： Shih-Hua Lu ,  Shang-Wei Hsieh ,  Chao-Chien Chiu

IPC: G01J1/04 ,  G02B1/115 ,  G02B5/00 ,  G06V40/13

CPC classification number: G01J1/0418 ,  G02B1/115 ,  G02B5/005 ,  G06V40/1318

Abstract: An optical sensing device includes a substrate, a sensing element layer, a light-shielding layer, and a light absorbing layer. The substrate has a first surface and a second surface opposite to each other. The sensing element layer is disposed on the first surface and includes multiple sensing elements. The light-shielding layer is disposed on the sensing element layer and has multiple openings. An orthogonal projection of the opening on the substrate overlaps an orthogonal projection of the sensing element on the substrate. The light absorbing layer is disposed on the second surface. An electronic apparatus including the optical sensing device is also provided.

公开(公告)号：US11139404B2

公开(公告)日：2021-10-05

申请号：US16538833

申请日：2019-08-13

Applicant: Au Optronics Corporation

Inventor： Po-Chao Chang ,  Ruei-Pei Chen ,  Chao-Chien Chiu

IPC: H01L27/146 ,  H01L31/0216 ,  H01L31/02 ,  H01L31/0224 ,  G06K9/00

Abstract: A photosensor includes a substrate, a sensing device, and a light shielding layer. The sensing device is disposed on the substrate and includes a first electrode, a photo-sensing layer, and a second electrode. The first electrode is disposed on the substrate. The photo-sensing layer is disposed on the first electrode. The second electrode is disposed on the photo-sensing layer, and the photo-sensing layer is interposed between the first electrode and the second electrode. The light shielding layer is disposed on the second electrode. Here, the photo-sensing layer has a shielded portion shielded by the light shielding layer and a photo-receiving portion not shielded by the light shielding layer, and an area of the shielded portion is 55% to 99% of an entire area of the photo-sensing layer.

公开(公告)号：US20190252411A1

公开(公告)日：2019-08-15

申请号：US16009243

申请日：2018-06-15

Applicant: Au Optronics Corporation

Inventor： Cheng-Chieh Lee ,  Chao-Chien Chiu

IPC: H01L27/12

CPC classification number: H01L27/124 ,  G02F1/136286 ,  G02F1/1368 ,  G02F2001/13629 ,  G02F2201/56 ,  H01L27/1218

Abstract: A display panel having a notch extending inwardly from its edge and including a plurality of first signal lines having a first extending direction, a plurality of second signal lines having a second extending direction different from the first extension direction, a plurality of pixel units, and a plurality of transmission lines is provided. The pixel units are electrically connected to the first signal lines and the second signal lines. The transmission lines are electrically connected to the first signal lines. Part of the transmission lines includes a first sub-transmission line, a second sub-transmission line and a third sub-transmission line electrically connected to each other. The first sub-transmission line is disposed between the adjacent second signal lines. The second sub-transmission line is disposed between the adjacent first signal lines. The third sub-transmission line overlaps another transmission line in the second extending direction.

公开(公告)号：US09252167B2

公开(公告)日：2016-02-02

申请号：US14486069

申请日：2014-09-15

Applicant: AU Optronics Corporation

Inventor： Jia-Hong Ye ,  Ssu-Hui Lu ,  Wu-Hsiung Lin ,  Chao-Chien Chiu ,  Ming-Hsien Lee ,  Chia-Tien Peng ,  Wei-Ming Huang

IPC: H01L27/12 ,  H01L29/786

CPC classification number: H01L27/1255 ,  H01L27/1218 ,  H01L27/1248 ,  H01L29/78603

Abstract: An active device array substrate includes a flexible substrate, a gate electrode, a dielectric layer, a channel layer, a source electrode, a drain electrode, and a pixel electrode. The flexible substrate has a transistor region and a transparent region adjacent to each other. The gate electrode is disposed on the transistor region. The dielectric layer covers the flexible substrate and the gate electrode. A portion of the dielectric layer disposed on the gate electrode has a first thickness. Another portion of the dielectric layer disposed on the transparent region has a second thickness less than the first thickness. The channel layer is disposed above the gate electrode. The source electrode and the drain electrode are electrically connected to the channel layer. The pixel electrode is disposed on the dielectric layer which is disposed on the transparent region. The pixel electrode is electrically connected to the drain electrode.

Abstract translation: 有源器件阵列衬底包括柔性衬底，栅电极，电介质层，沟道层，源电极，漏电极和像素电极。 柔性基板具有彼此相邻的晶体管区域和透明区域。 栅电极设置在晶体管区域上。 电介质层覆盖柔性基板和栅电极。 布置在栅电极上的介电层的一部分具有第一厚度。 布置在透明区域上的介电层的另一部分具有小于第一厚度的第二厚度。 沟道层设置在栅电极的上方。 源电极和漏极电连接到沟道层。 像素电极设置在布置在透明区域上的电介质层上。 像素电极电连接到漏电极。

公开(公告)号：US11734946B2

公开(公告)日：2023-08-22

申请号：US17338706

申请日：2021-06-04

Applicant: Au Optronics Corporation

Inventor： Chao-Chien Chiu ,  Shuo-Hong Wang ,  Shih-Hua Lu ,  Hsun-Chen Chu ,  Yan-Liang Chen

IPC: H01L27/32 ,  G06V40/13 ,  H01L27/146 ,  G06F3/042

CPC classification number: G06V40/1318 ,  G06F3/042 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14645 ,  H01L27/14678

Abstract: A fingerprint sensing module includes a first substrate, an active device, a photosensitive element layer, a collimation structure layer, a second substrate, a plurality of micro lenses, and a spacer pattern. The active device is disposed on the first substrate. The photosensitive element layer is disposed on the first substrate and is electrically connected to the active device. The collimation structure layer is disposed on the photosensitive element layer. The second substrate is disposed on the collimation structure layer. The micro lenses are disposed on a surface of the collimation structure layer facing away from the photosensitive element layer, and overlap the photosensitive element layer. The micro lenses are divided into a plurality of microlens groups, and the microlens groups are respectively located in a plurality of sensing pixel areas of the fingerprint sensing module. The spacer pattern extends between the microlens groups.

公开(公告)号：US20220373387A1

公开(公告)日：2022-11-24

申请号：US17711070

申请日：2022-04-01

Applicant: Au Optronics Corporation

Inventor： Shih-Hua Lu ,  Shang-Wei Hsieh ,  Chao-Chien Chiu

IPC: G01J1/04 ,  G02B5/00 ,  G02B1/115

Abstract: An optical sensing device includes a substrate, a sensing element layer, a light-shielding layer, and a light absorbing layer. The substrate has a first surface and a second surface opposite to each other. The sensing element layer is disposed on the first surface and includes multiple sensing elements. The light-shielding layer is disposed on the sensing element layer and has multiple openings. An orthogonal projection of the opening on the substrate overlaps an orthogonal projection of the sensing element on the substrate. The light absorbing layer is disposed on the second surface. An electronic apparatus including the optical sensing device is also provided.