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公开(公告)号：US10748848B2
公开(公告)日：2020-08-18
申请号：US16188286
申请日：2018-11-13
发明人： Chih-Hao Wang , Po-Fu Huang , Shang-Lin Chiang , Tsai-Chi Yeh , Chih-Hung Chen
IPC分类号： H01L23/528 , H01L23/00
摘要： An electronic device includes a substrate, first signal lines, pixel structures, first pads, transmission pads, a first combination circuit board, and a transmission circuit board. The first pads are electrically connected to some of a plurality of first signal lines. The transmission pads are electrically connected to some of the first signal lines. The first combination circuit board is disposed between a first side and a second side of the substrate opposite to each other. The transmission circuit board is disposed between the first combination circuit board and the second side of the substrate. The first combination circuit board is electrically connected to at least some of the first pads, and a first pitch exists between the adjacent first pads. The transmission pads are electrically connected to the transmission circuit board, and a transmission-pad pitch exists between the adjacent transmission pads. The transmission-pad pitch is greater than the first pitch.
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公开(公告)号：US09307655B2
公开(公告)日：2016-04-05
申请号：US14321995
申请日：2014-07-02
发明人： Chih-Hung Chen , Po-Fu Huang , Chih-Hao Wang
CPC分类号： H05K3/361 , H05K1/0269 , H05K3/323 , H05K3/4015 , H05K2201/0233 , H05K2201/09745 , H05K2201/09781 , H05K2201/10136
摘要： A circuit board module includes a first circuit board, an electrically conductive structure, a first bump, a second circuit board and an electrically conductive film. The electrically conductive structure and the first bump are disposed on the supporting surface of the first circuit board. The electrically conductive structure and the first bump respectively have a first maximal thickness T1 and a second maximal thickness T2 along the normal direction of the supporting surface. The second circuit board is disposed on the electrically conductive structure and the first bump. The electrically conductive film is disposed between the second circuit board and the electrically conductive structure, and it has a plurality of electrically conductive particles. An average particle diameter D of the electrically conductive particles when undeformed satisfies: 0
摘要翻译： 电路板模块包括第一电路板，导电结构，第一凸块，第二电路板和导电膜。 导电结构和第一凸块设置在第一电路板的支撑表面上。 导电结构和第一凸块分别具有沿着支撑表面的法线方向的第一最大厚度T1和第二最大厚度T2。 第二电路板设置在导电结构和第一凸块上。 导电膜设置在第二电路板和导电结构之间，并且其具有多个导电颗粒。 当未变形时导电颗粒的平均粒径D满足：0
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公开(公告)号：US20190385944A1
公开(公告)日：2019-12-19
申请号：US16188286
申请日：2018-11-13
发明人： Chih-Hao Wang , Po-Fu Huang , Shang-Lin Chiang , Tsai-Chi Yeh , Chih-Hung Chen
IPC分类号： H01L23/528 , H01L23/00
摘要： An electronic device includes a substrate, first signal lines, pixel structures, first pads, transmission pads, a first combination circuit board, and a transmission circuit board. The first pads are electrically connected to some of a plurality of first signal lines. The transmission pads are electrically connected to some of the first signal lines. The first combination circuit board is disposed between a first side and a second side of the substrate opposite to each other. The transmission circuit board is disposed between the first combination circuit board and the second side of the substrate. The first combination circuit board is electrically connected to at least some of the first pads, and a first pitch exists between the adjacent first pads. The transmission pads are electrically connected to the transmission circuit board, and a transmission-pad pitch exists between the adjacent transmission pads. The transmission-pad pitch is greater than the first pitch.
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