公开(公告)号：US09307655B2

公开(公告)日：2016-04-05

申请号：US14321995

申请日：2014-07-02

申请人： AU Optronics Corporation

发明人： Chih-Hung Chen ,  Po-Fu Huang ,  Chih-Hao Wang

IPC分类号： H05K3/36 ,  H05K1/02 ,  H05K3/32 ,  H05K3/40

CPC分类号： H05K3/361 ,  H05K1/0269 ,  H05K3/323 ,  H05K3/4015 ,  H05K2201/0233 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2201/10136

摘要： A circuit board module includes a first circuit board, an electrically conductive structure, a first bump, a second circuit board and an electrically conductive film. The electrically conductive structure and the first bump are disposed on the supporting surface of the first circuit board. The electrically conductive structure and the first bump respectively have a first maximal thickness T1 and a second maximal thickness T2 along the normal direction of the supporting surface. The second circuit board is disposed on the electrically conductive structure and the first bump. The electrically conductive film is disposed between the second circuit board and the electrically conductive structure, and it has a plurality of electrically conductive particles. An average particle diameter D of the electrically conductive particles when undeformed satisfies: 0

摘要翻译： 电路板模块包括第一电路板，导电结构，第一凸块，第二电路板和导电膜。 导电结构和第一凸块设置在第一电路板的支撑表面上。 导电结构和第一凸块分别具有沿着支撑表面的法线方向的第一最大厚度T1和第二最大厚度T2。 第二电路板设置在导电结构和第一凸块上。 导电膜设置在第二电路板和导电结构之间，并且其具有多个导电颗粒。 当未变形时导电颗粒的平均粒径D满足：0

公开(公告)号：US20150034366A1

公开(公告)日：2015-02-05

申请号：US14481188

申请日：2014-09-09

申请人： Panasonic Corporation

发明人： Shingo YOSHIOKA ,  Hiroaki FUJIWARA ,  Hiromitsu TAKASHITA ,  Tsuyoshi TAKEDA

IPC分类号： H05K1/02 ,  H05K1/11

CPC分类号： H05K1/119 ,  H01L2224/81385 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0032 ,  H05K3/0044 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/0085 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4007 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0239 ,  H05K2201/0376 ,  H05K2201/0769 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/09972 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/0143 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/0285 ,  H05K2203/0565 ,  H05K2203/0706 ,  H05K2203/0776 ,  H05K2203/1163 ,  Y02P70/611

摘要： One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.

摘要翻译： 本发明的一个方面涉及一种包括绝缘基底的电路板; 以及电路层，其由导体形成，并且设置在所述绝缘基底基板的表面上，其中所述绝缘基底具有表面粗糙度Ra为0.5μm以下的平滑表面，并且所述导体至少部分地 嵌入形成在绝缘性基板的表面的布线槽。

公开(公告)号：US08569189B2

公开(公告)日：2013-10-29

申请号：US12994880

申请日：2009-06-03

申请人： Rabin Bhattacharya ,  Liesbeth Van Pieterson ,  Koen Van Os ,  Thomas Schuler ,  Guido Lamerichs ,  Erwin Altewischer

发明人： Rabin Bhattacharya ,  Liesbeth Van Pieterson ,  Koen Van Os ,  Thomas Schuler ,  Guido Lamerichs ,  Erwin Altewischer

IPC分类号： B32B5/16

CPC分类号： H05K1/038 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/0233 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10393 ,  Y10T29/49117 ,  Y10T442/2008 ,  Y10T442/2041 ,  Y10T442/2098 ,  Y10T442/2107 ,  Y10T442/2123 ,  Y10T442/2738

摘要： The invention relates to an electronic textile comprising a textile substrate having a substrate electrode, and an electronic component having a component electrode. The component electrode is in electrically conductive contact with the substrate electrode via a coupling layer having a directionally dependent conductance so as to preferentially allow an electrical current to flow between the substrate electrode and the component electrode. As the coupling layer does not have to be patterned to prevent the occurrence of parasitic electrical currents, the electrically conductive contact between the substrate electrode and the component electrode has an improved reliability.

摘要翻译： 本发明涉及一种电子织物，其包括具有基底电极的织物基底和具有部件电极的电子部件。 部件电极通过具有方向依赖电导的耦合层与衬底电极导电接触，以便优先地允许电流在衬底电极和部件电极之间流动。 由于耦合层不必被图案化以防止寄生电流的发生，所以基板电极和部件电极之间的导电接触具有改进的可靠性。

公开(公告)号：US20120152455A1

公开(公告)日：2012-06-21

申请号：US13403316

申请日：2012-02-23

申请人： Min-Sok JANG ,  Kyung-Hwan KO ,  Seung-Il LEE ,  Jin-Wook MOON ,  Jeong-Geun HAN

发明人： Min-Sok JANG ,  Kyung-Hwan KO ,  Seung-Il LEE ,  Jin-Wook MOON ,  Jeong-Geun HAN

IPC分类号： B32B37/12 ,  B05D5/12

CPC分类号： H05K3/323 ,  B22F1/025 ,  H05K2201/0218 ,  H05K2201/0233 ,  Y10T428/2991

摘要： In an anisotropic conductive adhesive containing a conductive particle, the conductive particle includes a resin particle that is provided with a cavity formed therein and a conductive layer surrounding a surface of the resin particle. The cavity is formed by mixing the resin particle with a reactant and partially removing the reactant from the resin particle. Thus, the conductive particle may readily absorb an external pressure, thereby providing an improved malleability to the conductive particle.

摘要翻译： 在含有导电性粒子的各向异性导电性粘合剂中，导电性粒子包括树脂粒子，该树脂粒子形成有腔，该导电性层包围树脂粒子的表面。 通过将树脂颗粒与反应物混合并从树脂颗粒中部分除去反应物而形成空腔。 因此，导电性粒子可以容易地吸收外部压力，从而为导电性粒子提供改善的延展性。

公开(公告)号：US07291393B2

公开(公告)日：2007-11-06

申请号：US10489406

申请日：2002-09-17

申请人： Takeshi Wakiya ,  Yoshikazu Yoneda ,  Masako Ueba

发明人： Takeshi Wakiya ,  Yoshikazu Yoneda ,  Masako Ueba

IPC分类号： B32B5/16 ,  B05D7/00

CPC分类号： H05K3/323 ,  B22F1/0062 ,  B22F2998/00 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  Y10T428/2991 ,  Y10T428/2998 ,  B22F1/025

摘要： An objective of the invention is to provide a coated conductive particle having superior connection reliability, a method for manufacturing such coated conductive particle, an anisotropic conductive material and a conductive-connection structure.A coated conductive particle comprising a particle having a surface made of conductive metal and an insulating particles to coat the surface of the particle having the surface made of conductive metal there with, wherein the insulating particles are chemically bonded to the particle having the surface made of conductive metal via a functional group (A) having a bonding property to the conductive metal so that a single coating layer is formed.

摘要翻译： 本发明的目的是提供具有优异连接可靠性的涂覆导电颗粒，这种涂覆导电颗粒的制造方法，各向异性导电材料和导电连接结构。 包括具有由导电金属制成的表面的颗粒和绝缘颗粒的涂覆的导电颗粒，以将具有由导电金属制成的表面的颗粒的表面涂覆在其上，其中绝缘颗粒化学键合到具有由 导电金属经由具有与导电金属的接合特性的官能团（A），从而形成单个涂层。

公开(公告)号：US06947258B1

公开(公告)日：2005-09-20

申请号：US10176016

申请日：2002-06-19

申请人： Weijin Li

发明人： Weijin Li

IPC分类号： G11B17/32 ,  H01B1/22 ,  H05K3/32

CPC分类号： H01B1/22 ,  H05K3/321 ,  H05K2201/0221 ,  H05K2201/0233

摘要： An electrically conductive adhesive includes a resin component, a photoinitiator, and metal-coated polymer beads. The beads have an average diameter and a very narrow size distribution around the average diameter. The adhesive is applied between a read/write head and a suspension to attach the two, and the adhesive is cured by exposure to an illumination and/or heat. A pad spacer is included between the read/write head and the suspension to define a spacing and parallelism therebetween. The beads in the adhesive can form one or more layers between the read/write head and the suspension or can be disordered. The metal coating of the beads provide electrical conductivity between the read/write head and the suspension.

摘要翻译： 导电粘合剂包括树脂组分，光引发剂和金属涂覆的聚合物珠粒。 珠具有围绕平均直径的平均直径和非常窄的尺寸分布。 将粘合剂施加在读/写头和悬架之间以附接两者，并且粘合剂通过暴露于照明和/或热而固化。 读/写头和悬架之间包括衬垫间隔件，以限定它们之间的间隔和平行度。 粘合剂中的珠粒可以在读/写头和悬浮液之间形成一个或多个层，或者可以是无序的。 珠的金属涂层在读/写头和悬架之间提供导电性。

公开(公告)号：US5965064A

公开(公告)日：1999-10-12

申请号：US176167

申请日：1998-10-21

申请人： Yukio Yamada ,  Masao Saito ,  Junji Shinozaki ,  Motohide Takeichi

发明人： Yukio Yamada ,  Masao Saito ,  Junji Shinozaki ,  Motohide Takeichi

IPC分类号： C09J9/02 ,  H01B1/22 ,  H01L21/60 ,  H01R4/04 ,  H05K3/32 ,  H01B1/02 ,  B32B5/00

CPC分类号： H01L24/83 ,  C09J9/02 ,  H01B1/22 ,  H01L24/29 ,  H01L24/81 ,  H01R4/04 ,  H05K3/323 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01R12/52 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0266 ,  Y10T428/2998

摘要： An anisotropically electroconductive adhesive to be used for establishing electric connection between terminals of, for example, an IC chip and of a circuit pattern, at a low cost with high reliabilities both in the establishment of electric connection and in the insulation upon the connection without suffering from short-circuiting between circuit lines in the circuit and without causing any obstruction on the circuit, even when the terminals or the circuit lines are disposed at close intervals, which adhesive comprises an electrically insulating adhesive matrix and electroconductive particles dispersed in the matrix, wherein the electroconductive particles comprise at least two electroconductive particulate products of different average particle sizes and wherein each particle of both the particulate products is coated with an electrically insulating resin insoluble in the insulating adhesive matrix.

摘要翻译： 用于在例如IC芯片和电路图案的端子之间建立电连接的各向异性导电粘合剂以低成本建立电连接并且在连接时的绝缘性方面具有高可靠性而不遭受痛苦 即使当端子或电路线以紧密的间隔设置时，即使在电路中的电路线之间短路并且不引起电路上的任何障碍，该粘合剂包括分散在基体中的电绝缘粘合基质和导电颗粒，其中 导电颗粒包含至少两种不同平均粒度的导电颗粒产品，并且其中两种颗粒产品的每个颗粒都涂覆有不溶于绝缘粘合剂基质的电绝缘树脂。

公开(公告)号：US5769996A

公开(公告)日：1998-06-23

申请号：US464733

申请日：1995-06-29

申请人： Ciaran Bernard McArdle ,  Joseph Burke

发明人： Ciaran Bernard McArdle ,  Joseph Burke

IPC分类号： H05K1/09 ,  C09J5/06 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01B1/00 ,  H01B1/20 ,  H01B5/00 ,  H01B5/16 ,  H01F1/44 ,  H01F41/16 ,  H01L21/60 ,  H01R4/04 ,  H05K3/32 ,  B32B31/20

CPC分类号： H05K3/323 ,  H01F1/44 ,  H01F41/16 ,  H01R4/04 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/12069 ,  Y10T428/12347

摘要： The invention provides a composition comprising: (i) a ferrofluid comprising a colloidal suspension of ferromagnetic particles in a non-magnetic carrier liquid, and (ii) a plurality of electrically-conductive particles having substantially uniform sizes and shapes, dispersed in the ferrofluid. Various types of substantially non-magnetic electrically-conductive particles are described. Application of a substantially uniform magnetic field by magnet means to the composition causes the electrically-conductive particles to form a regular pattern. The composition is used for providing anisotropic conductive pathways between two sets of conductors in the electronics industry. The composition may be a curable adhesive composition which bonds the conductors. Alternatively or in addition the electrically-conductive particles may have a latent adhesive property e.g. the particles may be solder particles. The ferrofluid may be a colloidal suspension of ferromagnetic particles in a liquid monomer.

摘要翻译： PCT No.PCT / IE95 / 00009 Sec。 371日期：1995年6月29日 102（e）1995年6月29日PCT PCT 1995年1月26日PCT公布。 公开号WO95 / 20820 PCT 日期1995年8月3日本发明提供一种组合物，其包含：（i）包含非磁性载体液体中的铁磁颗粒的胶态悬浮液的铁磁流体，和（ii）具有基本均匀尺寸和形状的多个导电颗粒， 分散在铁磁流体中。 描述了各种类型的基本上非磁性的导电颗粒。 通过磁体将施加大致均匀的磁场的组合物导致导电颗粒形成规则图案。 该组合物用于在电子工业中的两组导体之间提供各向异性导电通路。 组合物可以是结合导体的可固化粘合剂组合物。 或者或另外，导电颗粒可以具有潜在的粘合性，例如 颗粒可以是焊料颗粒。 铁磁流体可以是液体单体中的铁磁颗粒的胶态悬浮液。

公开(公告)号：US5710612A

公开(公告)日：1998-01-20

申请号：US851659

申请日：1992-03-16

申请人： Akira Mase

发明人： Akira Mase

IPC分类号： G02F1/13 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  G02F1/1345 ,  G02F1/1333

CPC分类号： G02F1/13452 ,  H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  G02F2203/69 ,  H05K1/0306 ,  H05K1/148 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036 ,  H05K3/368

摘要： A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

摘要翻译： 对液晶装置及其制造方法进行说明。 该装置包括液晶面板和形成有用于向液晶装置提供驱动信号的IC电路的辅助面板。 辅助基板分别设置有电路，其功能在与液晶面板的组装之前进行测试。 通过该程序，产率大大提高。

公开(公告)号：US5688584A

公开(公告)日：1997-11-18

申请号：US534630

申请日：1995-09-27

申请人： Keith L. Casson ,  Carol Myers ,  Kenneth B. Gilleo ,  Deanna Suilmann ,  Edward Mahagnoul ,  Marion Tibesar

发明人： Keith L. Casson ,  Carol Myers ,  Kenneth B. Gilleo ,  Deanna Suilmann ,  Edward Mahagnoul ,  Marion Tibesar

IPC分类号： H05K3/28 ,  H05K3/32 ,  H05K3/36 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/462 ,  H05K3/323 ,  H05K3/368 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H05K2201/0233 ,  H05K2201/0266 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10666 ,  H05K2203/0425 ,  H05K2203/061 ,  H05K2203/1572 ,  H05K3/28 ,  H05K3/321 ,  H05K3/4623 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49149 ,  Y10T428/24917 ,  Y10T428/2857 ,  Y10T428/287

摘要： A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

摘要翻译： 公开了一种具有三个或更多个导电层的多层电路板，其中至少两个导电层通过互连粘合剂层电连接和机械连接。 互连粘合剂层包括导电粘合剂材料，其具有基本上分散在非导电粘合剂上分散的多个可变形的热熔金属颗粒。 制造的多层电路板具有可靠，耐热和能够承受热循环和典型的电路板精加工和组装过程的互连。