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4 条记录 (耗时 0.009 秒)

    CIRCUIT DEVICE
    1.
    发明公开
    CIRCUIT DEVICE 审中-公开

    公开(公告)号：US20240306294A1

    公开(公告)日：2024-09-12

    申请号：US18535247

    申请日：2023-12-11

    申请人： AUO Corporation

    发明人： CHUN-YUEH HOU ,  Hao-An Chuang ,  Hsi-Hung Chen

    IPC分类号： H05K1/09 ,  H01L27/15 ,  H05K3/28

    CPC分类号： H05K1/092 ,  H01L27/156 ,  H05K3/28 ,  H05K2201/10128 ,  H05K2203/1377

    摘要： A circuit device includes a circuit substrate, a protective layer and a side trace. The circuit substrate has a first surface, a second surface opposite to the first surface, and a side surface. A first turning region is provided between the first surface and the side surface. A second turning region is provided between the second surface and the side surface. The circuit substrate includes a carrier plate and a first circuit structure. The first circuit structure is located on the carrier plate, and includes a pad located on the first surface. The protective layer at least partially covers the first turning region and the second turning region. A material of the protective layer includes cured silver paste, epoxy resin or an acrylic-based insulating material. The side trace is located on the protective layer, and extends from the pad across the side surface to the second surface.

    ELECTRONIC DEVICE
    2.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240147639A1

    公开(公告)日：2024-05-02

    申请号：US18480523

    申请日：2023-10-04

    申请人： AUO Corporation

    发明人： Chih-Wen Lu ,  Fan-Yu Chen ,  Chun-Yueh Hou ,  Hsi-Hung Chen

    IPC分类号： H05K5/02

    CPC分类号： H05K5/02

    摘要： An electronic device includes a substrate, a side wiring, a protective film, and a first filler. The substrate has a first surface, a second surface, and a side surface connected between the first surface and the second surface. The side wiring is disposed on the substrate and extends from the first surface to the second surface through the side surface. The protective film is disposed on the side wiring. The side wiring is sandwiched between the substrate and the protective film. An edge of the protective film extends beyond a side wall of the side wiring, and the protective film, the side wall of the side wiring, and the substrate define a gap. The first filler is disposed on the protective film and in the gap, wherein the first filler includes a first material and a plurality of particles mixed within the first material.

    SIDE WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF
    3.
    发明公开
    SIDE WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20240260174A1

    公开(公告)日：2024-08-01

    申请号：US18346866

    申请日：2023-07-05

    申请人： AUO Corporation

    发明人： Hsi-Hung Chen ,  Hao-An Chuang

    IPC分类号： H05K1/02

    CPC分类号： H05K1/028 ,  H01L25/0753

    摘要： A side wiring structure includes a first substrate, a first wiring structure, a first side wire, a first insulating adhesive structure, a second side wire, a first flexible circuit board, and a second flexible circuit board. The first wiring structure is located on a first surface of the first substrate. The first side wire extends from the first wiring structure on the first surface to the second surface along the side surface on the first substrate. The first insulating adhesive structure is located above the first side wire and extends from above the first surface of the first substrate to above the side surface of the first substrate. The first insulating adhesive structure is located between the first and second side wires. The first and second flexible circuit boards are electrically connected to the first and second side wires, respectively.