公开(公告)号：US12082352B2

公开(公告)日：2024-09-03

申请号：US17869934

申请日：2022-07-21

申请人： Avary Holding (Shenzhen) Co., Limited. ,  QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD ,  GARUDA TECHNOLOGY CO., LTD.

发明人： Yao-Cai Li ,  Biao Li ,  Hao-Wen Zhong

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/02 ,  H05K3/06 ,  H05K3/22 ,  H05K3/28 ,  H05K3/32 ,  H05K3/46

CPC分类号： H05K3/4635 ,  H05K1/118 ,  H05K3/28 ,  H05K3/462 ,  H05K2201/0338 ,  H05K2203/1377

摘要： A flexible circuit board includes two first wiring boards, a first adhesive, and a first conductive structure. Each of the two first wiring boards includes a first bent portion, and two first bent portions of the two wiring boards is connected to each other. The first adhesive layer is sandwiched between the two first bent portions. The first conductive structure penetrates the two first bent portions and the first adhesive layer and electrically connects the two first bent portions.

公开(公告)号：US11985804B2

公开(公告)日：2024-05-14

申请号：US17383241

申请日：2021-07-22

申请人： QUALCOMM Incorporated

发明人： Anirudh Bhat ,  Jay Scott Salmon

IPC分类号： H05K9/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28

CPC分类号： H05K9/0032 ,  H05K1/023 ,  H05K1/188 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2203/1377

摘要： A package that includes a substrate, a first integrated device coupled to the substrate, a first block device coupled to the substrate, a second encapsulation layer encapsulating the first integrated device and the first block device. The first block device includes a first electrical component, a second electrical component, a first encapsulation layer at least partially encapsulating the first electrical component and the second electrical component, and a first metal layer coupled to the first encapsulation layer.

公开(公告)号：US11910531B2

公开(公告)日：2024-02-20

申请号：US17199408

申请日：2021-03-11

申请人： Ascensia Diabetes Care Holdings AG

发明人： Igor Y. Gofman

IPC分类号： H05K1/18 ,  A61B5/00 ,  A61B5/145 ,  H05K1/11 ,  H05K3/28

CPC分类号： H05K1/189 ,  A61B5/0002 ,  A61B5/14532 ,  H05K1/113 ,  H05K1/118 ,  H05K1/181 ,  H05K3/284 ,  H05K3/287 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2203/1377

摘要： A flexible printed circuit board (PCB) may have one or more coin cell batteries mounted thereto such that the flexibility of the flexible PCB is maintained. The flexible PCB has one or more battery contact pads fabricated thereon. Each battery contact pad includes a pattern of metalized vias each extending from a top surface to a bottom surface of the flexible PCB. A coin cell battery may be positioned over or under the battery contact pad. Conductive light curable epoxy is applied to and in each metalized via to contact and adhere to the coin cell battery to form a conductive path from the battery through the battery contact pad to printed conductors on the flexible PCB. Methods of mounting one or more coin cell batteries to a flexible PCB are also provided, as are other aspects.

公开(公告)号：US20240049395A1

公开(公告)日：2024-02-08

申请号：US18258556

申请日：2020-12-25

申请人： Resonac Corporation

发明人： Masaya TOBA ,  Kazuyuki MITSUKURA ,  Masaki YAMAGUCHI

IPC分类号： H05K1/18 ,  H05K3/02

CPC分类号： H05K1/181 ,  H05K3/022 ,  H05K2201/10553 ,  H05K2201/0358 ,  H05K2203/1377 ,  H05K2201/0209

摘要： A layered plate including a copper layer having a thickness of 5 μm or less, and a resin layer provided on a surface of the copper layer, in which a water absorption rate of the resin layer is 1% or less after being left in an environment of 130° C. in temperature and 85% in relative humidity for 200 hours.

公开(公告)号：US20170245374A1

公开(公告)日：2017-08-24

申请号：US14779731

申请日：2014-03-25

申请人： SEMBLANT LIMITED

发明人： Elizabeth Williams-Duncan

IPC分类号： H05K3/28 ,  H05K1/18

CPC分类号： H05K3/282 ,  H01L21/32138 ,  H01L23/552 ,  H01L23/562 ,  H01L23/564 ,  H01L2224/80007 ,  H01L2224/81007 ,  H01L2224/82007 ,  H01L2224/83007 ,  H01L2224/84007 ,  H01L2224/85007 ,  H01L2224/86007 ,  H05K1/181 ,  H05K3/285 ,  H05K2201/09872 ,  H05K2203/095 ,  H05K2203/1322 ,  H05K2203/1333 ,  H05K2203/1377

摘要： The present invention relates to an electrical assembly which has a conformal coating, wherein said conformal coating is obtainable by a method which comprises: (a) plasma polymerization of a compound of formula (I) and a fluorohydrocarbon, wherein the molar ratio of the compound of formula (I) to the fluorohydrocarbon is from 5:95 to 50:50, and deposition of the resulting polymer onto at least one surface of the electrical assembly: wherein: R1 represents C1-C3 alkyl or C2-C3 alkenyl; R2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and R6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl, and (b) plasma polymerization of a compound of formula (I) and deposition of the resulting polymer onto the polymer formed in step (a).

公开(公告)号：US20170065734A1

公开(公告)日：2017-03-09

申请号：US15119966

申请日：2015-01-21

申请人： Tetra Laval Holdings & Finance S.A.

发明人： Iosif IZRAILIT

IPC分类号： A61L2/08 ,  B65B55/08 ,  H05K7/20

CPC分类号： A61L2/087 ,  B65B55/08 ,  H05K1/11 ,  H05K1/185 ,  H05K3/285 ,  H05K7/20463 ,  H05K2201/10 ,  H05K2201/10151 ,  H05K2203/1377

摘要： Power supply unit, in particular for a sterilization device, comprising at least one electric component, wherein, at least one of the electric components is at least partly covered with a solid insulation layer, wherein the solid insulation layer is adapted to provide an electric insulation.

摘要翻译： 电源单元，特别是用于消毒装置，包括至少一个电气部件，其中，所述电气部件中的至少一个至少部分地被固体绝缘层覆盖，其中所述固体绝缘层适于提供电绝缘 。

公开(公告)号：US20240365478A1

公开(公告)日：2024-10-31

申请号：US18769438

申请日：2024-07-11

申请人： BOE Technology Group Co., Ltd.

发明人： Guoteng LI ,  Shuilang DONG ,  Xinhong LU ,  Liuqing LI ,  Jingshang ZHOU ,  Baoman LI ,  Zhao CUI ,  Yingwei LIU

IPC分类号： H05K3/46 ,  H05K1/11 ,  H05K3/16 ,  H05K3/40 ,  H05K5/00

CPC分类号： H05K3/4691 ,  H05K1/111 ,  H05K3/16 ,  H05K3/4007 ,  H05K5/0069 ,  H05K2203/0143 ,  H05K2203/0723 ,  H05K2203/1377

摘要： Embodiments of the present disclosure provide a circuit board, a display apparatus, and a manufacturing method for a circuit board. The manufacturing method for the circuit board includes: providing a precursor substrate; forming seed patterns and an auxiliary seed pattern on a side of the precursor substrate, where the seed patterns are located in the patterned areas, the auxiliary seed pattern is located in the non-patterned area, and the seed pattern and the auxiliary seed pattern are separated from each other; and forming a pad at a position of the seed pattern and an auxiliary pattern at a position of the auxiliary seed pattern by an electroplating process.

公开(公告)号：US20240268034A1

公开(公告)日：2024-08-08

申请号：US18382278

申请日：2023-10-20

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Jesang Park ,  Changgun Oh ,  Yangje Lee ,  Hyun Kyung Park

IPC分类号： H05K3/10 ,  H05K1/03 ,  H05K3/46

CPC分类号： H05K3/103 ,  H05K1/0306 ,  H05K3/4697 ,  H05K2201/0212 ,  H05K2201/0753 ,  H05K2201/099 ,  H05K2201/10204 ,  H05K2203/0186 ,  H05K2203/1377

摘要： A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.

公开(公告)号：US20180350780A1

公开(公告)日：2018-12-06

申请号：US16047688

申请日：2018-07-27

申请人： Infineon Technologies AG

发明人： Edward Fuergut ,  Holger Doepke ,  Olaf Hohlfeld ,  Michael Juerss

IPC分类号： H01L25/07

CPC分类号： H01L25/072 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/552 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/03462 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48491 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18301 ,  H05K3/282 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1377 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

摘要： An electronic device package includes a semiconductor chip having a contact pad on a main face of the semiconductor chip, a contact element disposed on the contact pad, a dielectric layer disposed on the semiconductor chip and the contact element, and an encapsulant disposed onto the dielectric layer.

公开(公告)号：US20180213652A1

公开(公告)日：2018-07-26

申请号：US15880204

申请日：2018-01-25

申请人： Vacuumschmelze GmbH & Co. KG

发明人： Harald HUNDT

IPC分类号： H05K3/28 ,  H05K1/18 ,  H05K1/02

CPC分类号： H05K3/284 ,  H05K1/0213 ,  H05K1/181 ,  H05K3/282 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0175 ,  H05K2203/1355 ,  H05K2203/1377

摘要： Electrically isolating an electrical or electronic assembly having a carrier and one or more electrical or electronic components mechanically and electrically connected with the carrier, includes coating the carrier or at least one of the components or both entirely or partially with powder. The powder includes powder particles of electrically isolating material that have an average particle diameter of less than 1000 micrometers.