公开(公告)号：US20240314919A1

公开(公告)日：2024-09-19

申请号：US18121489

申请日：2023-03-14

Applicant: Advanced Micro Devices, Inc.

Inventor： Paul Theodore ARTMAN ,  Mark STEINKE ,  Gamal REFAI-AHMED

IPC: H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0206 ,  H05K1/18 ,  H05K7/20336 ,  H05K7/205

Abstract: Disclosed herein are electronic devices that utilized a thermal bus disposed on a backside of a printed circuit board (PCB) to route heat efficiently to a thermal management device disposed on the front side of the PCB, thus enhancing thermal regulation of integrated circuit (IC) devices mounted on the backside of the PCB.

公开(公告)号：US20240290686A1

公开(公告)日：2024-08-29

申请号：US18113585

申请日：2023-02-23

Applicant: Advanced Micro Devices, Inc.

Inventor： Gamal REFAI-AHMED ,  Chi-Yi CHAO ,  Md Malekkul ISLAM ,  Suresh RAMALINGAM ,  Paul Theodore ARTMAN ,  Mark STEINKE ,  Christopher JAGGERS

IPC: H01L23/427 ,  H01L23/367 ,  H01L23/373 ,  H01L23/46

CPC classification number: H01L23/427 ,  H01L23/367 ,  H01L23/3732 ,  H01L23/46

Abstract: A heat exchanger for a chip package is provided. The heat exchanger includes a body having an upper side, a lower side, and an internal cavity disposed in the body between the upper side and the lower side. A first outlet port and a second outlet port are formed in the body and are in fluid communication with the internal cavity. An inlet port is formed through the upper side of the body between the first and second outlet ports to supply fluid into the internal cavity.