公开(公告)号：US20250069579A1

公开(公告)日：2025-02-27

申请号：US18236221

申请日：2023-08-21

Applicant: Advanced Micro Devices, Inc. ,  XILINX, INC.

Inventor： Gamal REFAI-AHMED ,  Christopher JAGGERS ,  Hoa DO ,  Md Malekkul ISLAM ,  Paul Theodore ARTMAN ,  Sukesh SHENOY ,  Suresh RAMALINGAM ,  Muhammad Afiq Bin In BAHAROM

IPC: G10K11/178

Abstract: In one example, a micro device includes a housing; a chip package disposed in the housing; a noise producing component coupled to the housing. The micro device also includes a noise reduction system having a reference microphone for detecting a noise from the noise producing component and a controller configured to receive the noise from the reference microphone and generate a masking sound signal in response to the detected noise. A speaker is coupled to the housing for producing a masking sound corresponding to the masking sound signal, whereby the masking sound reduces the noise. In another example, the noise producing component comprises a fan.

公开(公告)号：US20240314919A1

公开(公告)日：2024-09-19

申请号：US18121489

申请日：2023-03-14

Applicant: Advanced Micro Devices, Inc.

Inventor： Paul Theodore ARTMAN ,  Mark STEINKE ,  Gamal REFAI-AHMED

IPC: H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0206 ,  H05K1/18 ,  H05K7/20336 ,  H05K7/205

Abstract: Disclosed herein are electronic devices that utilized a thermal bus disposed on a backside of a printed circuit board (PCB) to route heat efficiently to a thermal management device disposed on the front side of the PCB, thus enhancing thermal regulation of integrated circuit (IC) devices mounted on the backside of the PCB.

公开(公告)号：US20240290686A1

公开(公告)日：2024-08-29

申请号：US18113585

申请日：2023-02-23

Applicant: Advanced Micro Devices, Inc.

Inventor： Gamal REFAI-AHMED ,  Chi-Yi CHAO ,  Md Malekkul ISLAM ,  Suresh RAMALINGAM ,  Paul Theodore ARTMAN ,  Mark STEINKE ,  Christopher JAGGERS

IPC: H01L23/427 ,  H01L23/367 ,  H01L23/373 ,  H01L23/46

CPC classification number: H01L23/427 ,  H01L23/367 ,  H01L23/3732 ,  H01L23/46

Abstract: A heat exchanger for a chip package is provided. The heat exchanger includes a body having an upper side, a lower side, and an internal cavity disposed in the body between the upper side and the lower side. A first outlet port and a second outlet port are formed in the body and are in fluid communication with the internal cavity. An inlet port is formed through the upper side of the body between the first and second outlet ports to supply fluid into the internal cavity.