公开(公告)号：US20250069579A1

公开(公告)日：2025-02-27

申请号：US18236221

申请日：2023-08-21

Applicant: Advanced Micro Devices, Inc. ,  XILINX, INC.

Inventor： Gamal REFAI-AHMED ,  Christopher JAGGERS ,  Hoa DO ,  Md Malekkul ISLAM ,  Paul Theodore ARTMAN ,  Sukesh SHENOY ,  Suresh RAMALINGAM ,  Muhammad Afiq Bin In BAHAROM

IPC: G10K11/178

Abstract: In one example, a micro device includes a housing; a chip package disposed in the housing; a noise producing component coupled to the housing. The micro device also includes a noise reduction system having a reference microphone for detecting a noise from the noise producing component and a controller configured to receive the noise from the reference microphone and generate a masking sound signal in response to the detected noise. A speaker is coupled to the housing for producing a masking sound corresponding to the masking sound signal, whereby the masking sound reduces the noise. In another example, the noise producing component comprises a fan.

公开(公告)号：US20240290686A1

公开(公告)日：2024-08-29

申请号：US18113585

申请日：2023-02-23

Applicant: Advanced Micro Devices, Inc.

Inventor： Gamal REFAI-AHMED ,  Chi-Yi CHAO ,  Md Malekkul ISLAM ,  Suresh RAMALINGAM ,  Paul Theodore ARTMAN ,  Mark STEINKE ,  Christopher JAGGERS

IPC: H01L23/427 ,  H01L23/367 ,  H01L23/373 ,  H01L23/46

CPC classification number: H01L23/427 ,  H01L23/367 ,  H01L23/3732 ,  H01L23/46

Abstract: A heat exchanger for a chip package is provided. The heat exchanger includes a body having an upper side, a lower side, and an internal cavity disposed in the body between the upper side and the lower side. A first outlet port and a second outlet port are formed in the body and are in fluid communication with the internal cavity. An inlet port is formed through the upper side of the body between the first and second outlet ports to supply fluid into the internal cavity.

公开(公告)号：US20240258190A1

公开(公告)日：2024-08-01

申请号：US18102065

申请日：2023-01-26

Applicant: Advanced Micro Devices, Inc.

Inventor： Gamal REFAI-AHMED ,  Chi-Yi CHAO ,  Christopher JAGGERS ,  Suresh RAMALINGAM ,  Sukesh SHENOY

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H01L23/40 ,  H01L23/427

CPC classification number: H01L23/3675 ,  H01L21/4817 ,  H01L23/4006 ,  H01L23/427 ,  H01L24/29 ,  H01L24/32 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L24/16 ,  H01L24/33 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/0665

Abstract: A chip package includes a substrate and an integrated circuit (“IC”) die mounted to the substrate. A stiffener frame is mounted to the substrate and circumscribes the IC die. The stiffener frame has a plurality of connected walls that define an opening in the stiffener frame. The chip package also includes a lid having a bottom side facing a top surface of the IC die. The lid has at least a first guide and a second guide extending from the bottom side of the lid. The first guide can be disposed outward or inward of the stiffener frame. The first guide has a side facing an outer wall surface or an inner wall surface of the stiffener frame. The first guide and the second guide are positioned to limit movement of the lid relative to the stiffener frame in two directions.