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公开(公告)号：US11315883B2
公开(公告)日：2022-04-26
申请号：US16680978
申请日：2019-11-12
IPC分类号： H01L23/544 , H01L23/18 , H01L23/12
摘要： An apparatus includes a substrate including an identification code on a first side of the substrate and near a perimeter of the substrate. The apparatus includes a stiffener structure attached to the first side of the substrate. The stiffener structure has a cutout in an outer perimeter of the stiffener structure. The stiffener structure is oriented with respect to the substrate to cause the cutout to expose the identification code. The cutout may have a first dimension and a second dimension orthogonal to the first dimension. The first dimension may exceed a corresponding first dimension of the identification code and the second dimension may exceed a corresponding second dimension of the identification code, thereby forming a void region between the identification code and edges of the stiffener structure.
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公开(公告)号：US20210143104A1
公开(公告)日：2021-05-13
申请号：US16680978
申请日：2019-11-12
IPC分类号： H01L23/544 , H01L23/18 , H01L23/12
摘要： An apparatus includes a substrate including an identification code on a first side of the substrate and near a perimeter of the substrate. The apparatus includes a stiffener structure attached to the first side of the substrate. The stiffener structure has a cutout in an outer perimeter of the stiffener structure. The stiffener structure is oriented with respect to the substrate to cause the cutout to expose the identification code. The cutout may have a first dimension and a second dimension orthogonal to the first dimension. The first dimension may exceed a corresponding first dimension of the identification code and the second dimension may exceed a corresponding second dimension of the identification code, thereby forming a void region between the identification code and edges of the stiffener structure.
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