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公开(公告)号：US11315883B2
公开(公告)日：2022-04-26
申请号：US16680978
申请日：2019-11-12
Applicant: Advanced Micro Devices, Inc. , ATI Technologies ULC
Inventor： Suming Hu , Roden Topacio , Farshad Ghahghahi , Jianguo Li , Andrew Kwan Wai Leung
IPC: H01L23/544 , H01L23/18 , H01L23/12
Abstract: An apparatus includes a substrate including an identification code on a first side of the substrate and near a perimeter of the substrate. The apparatus includes a stiffener structure attached to the first side of the substrate. The stiffener structure has a cutout in an outer perimeter of the stiffener structure. The stiffener structure is oriented with respect to the substrate to cause the cutout to expose the identification code. The cutout may have a first dimension and a second dimension orthogonal to the first dimension. The first dimension may exceed a corresponding first dimension of the identification code and the second dimension may exceed a corresponding second dimension of the identification code, thereby forming a void region between the identification code and edges of the stiffener structure.
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公开(公告)号：US20210143104A1
公开(公告)日：2021-05-13
申请号：US16680978
申请日：2019-11-12
Applicant: Advanced Micro Devices, Inc. , ATI Technologies ULC
Inventor： Suming Hu , Roden Topacio , Farshad Ghahghahi , Jianguo Li , Andrew Kwan Wai Leung
IPC: H01L23/544 , H01L23/18 , H01L23/12
Abstract: An apparatus includes a substrate including an identification code on a first side of the substrate and near a perimeter of the substrate. The apparatus includes a stiffener structure attached to the first side of the substrate. The stiffener structure has a cutout in an outer perimeter of the stiffener structure. The stiffener structure is oriented with respect to the substrate to cause the cutout to expose the identification code. The cutout may have a first dimension and a second dimension orthogonal to the first dimension. The first dimension may exceed a corresponding first dimension of the identification code and the second dimension may exceed a corresponding second dimension of the identification code, thereby forming a void region between the identification code and edges of the stiffener structure.
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公开(公告)号：US11955447B2
公开(公告)日：2024-04-09
申请号：US17528523
申请日：2021-11-17
Applicant: ADVANCED MICRO DEVICES, INC. , ATI TECHNOLOGIES ULC
Inventor： Suming Hu , Farshad Ghahghahi
IPC: H01L23/00
CPC classification number: H01L24/13 , H01L24/11 , H01L24/16 , H01L2224/11622 , H01L2224/13006 , H01L2224/13018 , H01L2224/13541 , H01L2224/13552 , H01L2224/13582 , H01L2224/16227 , H01L2224/16238
Abstract: In an implementation, a semiconductor chip includes a device layer, an interconnect layer fabricated on the device layer, the interconnect layer including a conductive pad, and a conductive pillar coupled to the conductive pad. The conductive pillar includes at least a first portion having a first width and a second portion having a second width, the first portion being disposed between the second portion and the conductive pad, wherein the first width of the first portion is greater than the second width of the second portion.
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公开(公告)号：US11335659B2
公开(公告)日：2022-05-17
申请号：US15395859
申请日：2016-12-30
Applicant: ATI TECHNOLOGIES ULC
Inventor： Roden R. Topacio , Suming Hu , Yip Seng Low
Abstract: Various semiconductor chip solder bump and underbump metallization (UBM) structures and methods of making the same are disclosed. In one aspect, a method is provided that includes forming a first underbump metallization layer on a semiconductor chip is provided. The first underbump metallization layer has a hub, a first portion extending laterally from the hub, and a spoke connecting the hub to the first portion. A polymer layer is applied to the first underbump metallization layer. The polymer layer includes a first opening in alignment with the hub and a second opening in alignment with the spoke. A portion of the spoke is removed via the second opening to sever the connection between the hub and the first portion.
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