公开(公告)号：US20220214488A1

公开(公告)日：2022-07-07

申请号：US17144114

申请日：2021-01-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Feng YOU ,  Jr-Wei LIN ,  Chieh-Chen FU ,  Kao-Ming SU ,  Chen Yuan Weng

IPC: F21V8/00 ,  G02B6/36

Abstract: A device is provided. The device may be an optical device, a light coupling device, or a tunable light coupling device. The device includes a first portion, a lens, a light emitting element, and a waveguide. The first portion is disposed adjacent to a surface of a substrate and has a first side and a second side opposite to the first side. The light emitting element is disposed adjacent to the second side of the first portion. The lens is disposed adjacent to the first side of the first portion and between the light emitting element and the waveguide.

公开(公告)号：US20230003956A1

公开(公告)日：2023-01-05

申请号：US17364431

申请日：2021-06-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Feng YOU ,  Yu-Yuan YEH ,  Jun-Wei CHEN

IPC: G02B6/42

Abstract: A semiconductor package structure and a method of manufacturing the same are provided. A semiconductor package structure includes a first electronic component and a light emitter. The photonic component includes a substrate and a first port. The light emitter is disposed over the substrate of the photonic component. The light emitter is configured to emit light through the first port. A coupling loss between the first port of the photonic component and the light emitter is less than 3 dB.