公开(公告)号：US11211319B2

公开(公告)日：2021-12-28

申请号：US16691296

申请日：2019-11-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Nan Fang ,  Chun-Jun Zhuang ,  Chen Yuan Weng

IPC: H01L23/498 ,  H01L23/528 ,  H01L23/544

Abstract: A device structure includes a first electronic structure and a plurality of first electric contacts. The first electronic structure has a surface and a center. The first electric contacts are exposed from the surface. The first electric contacts are spaced by a pitch that increases with increasing distance from the center.

公开(公告)号：US11217498B2

公开(公告)日：2022-01-04

申请号：US16671988

申请日：2019-11-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Nan Fang ,  Chien-Ching Chen ,  Chen Yuan Weng

IPC: H01L23/31 ,  H01L23/29 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor package includes a semiconductor die having a first surface and a second surface opposite to the first surface, a conductive wiring layer stacked with the semiconductor die and proximal to the first surface, an encapsulant encapsulating the semiconductor die and stacked with the conductive wiring layer, and a replacement structure exposing from the encapsulant and being free of fillers. A method for manufacturing the semiconductor package is also disclosed in the present disclosure.

公开(公告)号：US11474301B2

公开(公告)日：2022-10-18

申请号：US17144114

申请日：2021-01-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Feng You ,  Jr-Wei Lin ,  Chieh-Chen Fu ,  Kao-Ming Su ,  Chen Yuan Weng

IPC: G02B6/36 ,  G02F1/1337 ,  G02F1/29 ,  G02F1/133

Abstract: A device is provided. The device may be an optical device, a light coupling device, or a tunable light coupling device. The device includes a first portion, a lens, a light emitting element, and a waveguide. The first portion is disposed adjacent to a surface of a substrate and has a first side and a second side opposite to the first side. The light emitting element is disposed adjacent to the second side of the first portion. The lens is disposed adjacent to the first side of the first portion and between the light emitting element and the waveguide.

公开(公告)号：US20220214488A1

公开(公告)日：2022-07-07

申请号：US17144114

申请日：2021-01-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Feng YOU ,  Jr-Wei LIN ,  Chieh-Chen FU ,  Kao-Ming SU ,  Chen Yuan Weng

IPC: F21V8/00 ,  G02B6/36

Abstract: A device is provided. The device may be an optical device, a light coupling device, or a tunable light coupling device. The device includes a first portion, a lens, a light emitting element, and a waveguide. The first portion is disposed adjacent to a surface of a substrate and has a first side and a second side opposite to the first side. The light emitting element is disposed adjacent to the second side of the first portion. The lens is disposed adjacent to the first side of the first portion and between the light emitting element and the waveguide.