公开(公告)号：US20220236480A1

公开(公告)日：2022-07-28

申请号：US17719277

申请日：2022-04-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Hsuan WU ,  Yung-Hui WANG

IPC: G02B6/12 ,  G02B6/42

Abstract: An optical communication package structure includes a wiring structure, at least one via structure, a redistribution structure, at least one optical device and at least one electrical device. The wiring structure includes a main portion and a conductive structure disposed on an upper surface of the main portion. The main portion defines at least one through hole extending through the main portion. The via structure is disposed in the at least one through hole of the main portion and electrically connected to the conductive structure. The redistribution structure is disposed on a lower surface of the main portion and electrically connected to the via structure. The optical device is disposed adjacent to the upper surface of the main portion and electrically connected to the conductive structure. The electrical device is disposed on and electrically connected to the conductive structure.

公开(公告)号：US20250015069A1

公开(公告)日：2025-01-09

申请号：US18895205

申请日：2024-09-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu LIN ,  Cheng-Hsuan WU

IPC: H01L25/16 ,  G02B6/42 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.

公开(公告)号：US20220271019A1

公开(公告)日：2022-08-25

申请号：US17185499

申请日：2021-02-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu LIN ,  Cheng-Hsuan WU

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/00 ,  H01L21/78 ,  G02B6/42

Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.

公开(公告)号：US20230006114A1

公开(公告)日：2023-01-05

申请号：US17367052

申请日：2021-07-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Hsuan WU ,  Chang-Yu LIN ,  Yu-Sheng HUANG

IPC: H01L33/62 ,  H01L31/0224 ,  H01L23/488 ,  H01L33/58 ,  H01L31/0232 ,  G02B6/12

Abstract: An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.

公开(公告)号：US20210033785A1

公开(公告)日：2021-02-04

申请号：US16528331

申请日：2019-07-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Hsuan WU ,  Yung-Hui WANG

IPC: G02B6/12 ,  G02B6/42

Abstract: An optical communication package structure includes a wiring structure, at least one via structure, a redistribution structure, at least one optical device and at least one electrical device. The wiring structure includes a main portion and a conductive structure disposed on an upper surface of the main portion. The main portion defines at least one through hole extending through the main portion. The via structure is disposed in the at least one through hole of the main portion and electrically connected to the conductive structure. The redistribution structure is disposed on a lower surface of the main portion and electrically connected to the via structure. The optical device is disposed adjacent to the upper surface of the main portion and electrically connected to the conductive structure. The electrical device is disposed on and electrically connected to the conductive structure.