公开(公告)号：US20230006114A1

公开(公告)日：2023-01-05

申请号：US17367052

申请日：2021-07-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Hsuan WU ,  Chang-Yu LIN ,  Yu-Sheng HUANG

IPC: H01L33/62 ,  H01L31/0224 ,  H01L23/488 ,  H01L33/58 ,  H01L31/0232 ,  G02B6/12

Abstract: An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.