公开(公告)号：US20210005522A1

公开(公告)日：2021-01-07

申请号：US17027408

申请日：2020-09-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Han CHEN ,  Hsun-Wei CHAN ,  Mei-Yi WU

IPC: H01L23/10 ,  H01L23/04

Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.

公开(公告)号：US20190115505A1

公开(公告)日：2019-04-18

申请号：US16132206

申请日：2018-09-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chin TSAI ,  Chun-Han CHEN ,  Hsin-Ying HO

IPC: H01L33/48 ,  H01S5/022 ,  H01S5/40 ,  H01L33/62 ,  H01L33/56

Abstract: A semiconductor package includes a first substrate having a first surface, a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface adjacent to the first surface, and the first surface of the second substrate being disposed on the first surface of the first substrate, and a light source on the second surface of the second substrate. A method for manufacturing the semiconductor device package is also provided.