公开(公告)号：US20180233643A1

公开(公告)日：2018-08-16

申请号：US15860567

申请日：2018-01-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi WU ,  Lu-Ming LAI ,  Yu-Ying LEE ,  Yung-Yi CHANG

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/60

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

公开(公告)号：US20220328713A1

公开(公告)日：2022-10-13

申请号：US17227152

申请日：2021-04-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi WU ,  Chang Chin TSAI ,  Bo-Yu HUANG ,  Ying-Chung CHEN

IPC: H01L31/16 ,  H04B10/40 ,  H01L31/024 ,  H01L33/62 ,  H01L33/64

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.

公开(公告)号：US20210005522A1

公开(公告)日：2021-01-07

申请号：US17027408

申请日：2020-09-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Han CHEN ,  Hsun-Wei CHAN ,  Mei-Yi WU

IPC: H01L23/10 ,  H01L23/04

Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.

公开(公告)号：US20210013375A1

公开(公告)日：2021-01-14

申请号：US16509397

申请日：2019-07-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi WU

IPC: H01L33/48 ,  H01L23/00 ,  H01L33/62

Abstract: A semiconductor device package includes a carrier, a conductive pillar, an adhesive layer and a package body. The conductive pillar is disposed on the carrier. The conductive pillar has a top surface facing away from the carrier. The adhesive layer is disposed on the top surface of the conductive pillar. The package body is disposed on the carrier. The package body has a top surface facing away from the carrier. The top surface has a first portion and a second portion. The first portion and the second portion of the top surface of the package body are discontinuous.

公开(公告)号：US20200259058A1

公开(公告)日：2020-08-13

申请号：US16862447

申请日：2020-04-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi WU ,  Lu-Ming LAI ,  Yu-Ying LEE ,  Yung-Yi CHANG

IPC: H01L33/62 ,  B81C1/00 ,  H01L33/48

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

公开(公告)号：US20240170603A1

公开(公告)日：2024-05-23

申请号：US18427783

申请日：2024-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi WU ,  Chang Chin TSAI ,  Bo-Yu HUANG ,  Ying-Chung CHEN

IPC: H01L31/16 ,  H01L31/024 ,  H01L33/62 ,  H01L33/64 ,  H04B10/40

CPC classification number: H01L31/16 ,  H01L31/024 ,  H01L33/62 ,  H01L33/644 ,  H04B10/40

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.

公开(公告)号：US20190386187A1

公开(公告)日：2019-12-19

申请号：US16011555

申请日：2018-06-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi WU ,  Ying-Chung CHEN ,  Hsin-Ying HO

IPC: H01L33/56 ,  H01L33/62 ,  H01L31/0203 ,  H01L31/02

Abstract: An optical package device comprises a carrier, a die, a support element, and an encapsulant. The die is on the carrier. The support element is on the carrier and adjacent to the die. The encapsulant covers the die and the support element. The encapsulant has a first top surface over the die and a second top surface adjacent to the first top surface. A ratio of a distance between the first top surface and the second top surface of the encapsulant to a distance between the die and the first top surface of the encapsulant is less than 0.1.