公开(公告)号：US20250096774A1

公开(公告)日：2025-03-20

申请号：US18967532

申请日：2024-12-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Kuo-Hua LAI ,  Hui-Chung LIU

IPC: H03H9/24 ,  H03H3/007 ,  H03H9/05 ,  H03H9/08 ,  H03H9/10 ,  H03L1/02 ,  H03L1/04

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

公开(公告)号：US20210257988A1

公开(公告)日：2021-08-19

申请号：US16794112

申请日：2020-02-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Kuo-Hua LAI ,  Hui-Chung LIU

IPC: H03H9/24 ,  H03H3/007 ,  H03H9/05 ,  H03H9/08 ,  H03H9/10

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

公开(公告)号：US20240243207A1

公开(公告)日：2024-07-18

申请号：US18096355

申请日：2023-01-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiang-Cheng TSAI ,  Ying-Chung CHEN ,  Kuo-Hua LAI

IPC: H01L31/0203 ,  H01L31/0216

CPC classification number: H01L31/0203 ,  H01L31/02164

Abstract: An optical device package is provided. The optical device package includes a sensor and a light-transmitting region. The sensor includes a sensing region. The light-transmitting region is at least partially in the sensor, and the light-transmitting region allows an external light to transmit therethrough and reach the sensing region. A width of the light-transmitting region adjacent to a level of the sensing region is equal to or smaller than a width of the sensing region.

公开(公告)号：US20210036658A1

公开(公告)日：2021-02-04

申请号：US17074618

申请日：2020-10-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Hui-Chung LIU ,  Kuo-Hua LAI ,  Cheng-Ling HUANG

IPC: H03B5/04 ,  H01L23/13 ,  H01L23/00 ,  H01L23/36 ,  H03B5/30 ,  H01L23/14 ,  B81B7/00 ,  H03B5/36 ,  H03L1/04 ,  H03B1/02

Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

公开(公告)号：US20230208394A1

公开(公告)日：2023-06-29

申请号：US18112464

申请日：2023-02-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Kuo-Hua LAI ,  Hui-Chung LIU

IPC: H03H9/24 ,  H03H3/007 ,  H03H9/10 ,  H03H9/08 ,  H03H9/05 ,  H03L1/02 ,  H03L1/04

CPC classification number: H03H9/2426 ,  H03H3/0073 ,  H03H9/1057 ,  H03H9/08 ,  H03H9/0547 ,  H03L1/028 ,  H03L1/04

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.