公开(公告)号：US20240357751A1

公开(公告)日：2024-10-24

申请号：US18137938

申请日：2023-04-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Yu CHEN ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H05K5/00 ,  H05K1/16 ,  H05K3/36 ,  H05K5/02

CPC classification number: H05K5/0021 ,  H05K1/162 ,  H05K1/165 ,  H05K3/36 ,  H05K5/0247

Abstract: An electronic device is disclosed. The electronic device includes a first circuit structure, a second circuit structure having a surface facing the first circuit structure, and a first electronic component disposed over the first circuit structure and supporting the second circuit structure. The electronic device also includes a second electronic component disposed adjacent to the second circuit structure and having a top surface at an elevation higher than the surface of the second circuit structure with respect to the first circuit structure.

公开(公告)号：US20240038678A1

公开(公告)日：2024-02-01

申请号：US17877796

申请日：2022-07-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Yu CHEN ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01L23/552 ,  H01L25/10 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/552 ,  H01L25/105 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/162

Abstract: The present disclosure provides an electronic device. The electronic device includes a first interposer, a first interconnection array, a first shielding wall, and a second interconnection array. The first interconnection array is disposed in the first interposer and electrically connected to ground. The first shielding wall continuously extends at a side of the first interconnection array. The second interconnection array is disposed between the first shielding wall and the first interconnection array. The second interconnection array is configured to transmit a signal.